4.6 Article

Robust and Highly Conductive PEDOT:PSS:Ag Nanowires/Polyethyleneimine Multilayers Based on Ionic Layer-by-Layer Assembly for E-Textiles and 3D Electronics

Journal

ACS APPLIED ELECTRONIC MATERIALS
Volume 4, Issue 5, Pages 2413-2423

Publisher

AMER CHEMICAL SOC
DOI: 10.1021/acsaelm.2c00219

Keywords

PEDOT:PSS/PEI multilayers; layer-by-layer assembly; water-assisted welding; E-textile; 3D electronics

Funding

  1. National Research Foundation of Korea (NRF) - Korea government (MSIT) [2021R1A2C209338012]
  2. GIST Research Institute (GRI) - GIST

Ask authors/readers for more resources

This study demonstrates the production of robust and highly conductive multilayers through layer-by-layer assembly. The use of PEI results in the highest electrical conductivity and interfacial adhesion. Additionally, PEI provides a powerful interconnection for electrical circuit patterns with low contact resistance and robust mechanical durability.
This study shows the production of robust and highly conductive multilayers through the layer-by-layer (LBL) assembly of poly(3,4-ethylenedioxythiophene):poly( styrenesulfonate) (PE-DOT:PSS):Ag nanowires and counterionic compounds, including monomeric tris(2-aminoethyl)amine and chitosan and polyethylenimine (PEI). These materials provide a strong electrostatic interaction with PEDOT:PSS and enable a reliable interface between the layers during the LBL process. Systematic chemical and electrical analyses of the multilayers reveal that the use of PEI results in the highest electrical conductivity (2034 S cm(-1) at six LBL cycles) and interfacial adhesion (8.9 mN at the tearing stress). Furthermore, the use of PEI generates a powerful interconnection for electrical circuit patterns with low contact resistance (similar to 5 Omega) and robust mechanical durability during the water-assisted welding process. Finally, we successfully show the use of this material in electronic textile applications and 3D electronics based on water-assisted welding and transfer printing technology to confirm its feasibility for use in device applications.

Authors

I am an author on this paper
Click your name to claim this paper and add it to your profile.

Reviews

Primary Rating

4.6
Not enough ratings

Secondary Ratings

Novelty
-
Significance
-
Scientific rigor
-
Rate this paper

Recommended

No Data Available
No Data Available