Journal
ACS APPLIED ELECTRONIC MATERIALS
Volume 4, Issue 5, Pages 2413-2423Publisher
AMER CHEMICAL SOC
DOI: 10.1021/acsaelm.2c00219
Keywords
PEDOT:PSS/PEI multilayers; layer-by-layer assembly; water-assisted welding; E-textile; 3D electronics
Funding
- National Research Foundation of Korea (NRF) - Korea government (MSIT) [2021R1A2C209338012]
- GIST Research Institute (GRI) - GIST
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This study demonstrates the production of robust and highly conductive multilayers through layer-by-layer assembly. The use of PEI results in the highest electrical conductivity and interfacial adhesion. Additionally, PEI provides a powerful interconnection for electrical circuit patterns with low contact resistance and robust mechanical durability.
This study shows the production of robust and highly conductive multilayers through the layer-by-layer (LBL) assembly of poly(3,4-ethylenedioxythiophene):poly( styrenesulfonate) (PE-DOT:PSS):Ag nanowires and counterionic compounds, including monomeric tris(2-aminoethyl)amine and chitosan and polyethylenimine (PEI). These materials provide a strong electrostatic interaction with PEDOT:PSS and enable a reliable interface between the layers during the LBL process. Systematic chemical and electrical analyses of the multilayers reveal that the use of PEI results in the highest electrical conductivity (2034 S cm(-1) at six LBL cycles) and interfacial adhesion (8.9 mN at the tearing stress). Furthermore, the use of PEI generates a powerful interconnection for electrical circuit patterns with low contact resistance (similar to 5 Omega) and robust mechanical durability during the water-assisted welding process. Finally, we successfully show the use of this material in electronic textile applications and 3D electronics based on water-assisted welding and transfer printing technology to confirm its feasibility for use in device applications.
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