Journal
MATERIALS SCIENCE-POLAND
Volume 34, Issue 2, Pages 315-321Publisher
DE GRUYTER POLAND SP Z O O
DOI: 10.1515/msp-2016-0057
Keywords
SiNx:H; oxidation; PECVD; annealing temperature; elemental analysis
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Funding
- National Research Fund DGRSDT MESRS/Algeria
- Centre de Recherche en Technologie des Semi-conducteurs pour l'Energetique (CRTSE)
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Hydrogen, amorphous silicon nitride (SiNx:H abbreviated SiNx) films were grown on multicrystalline silicon (mc-Si) sub-strate by plasma enhanced chemical vapour deposition (PECVD) in parallel configuration using NH3/SiH4 gas mixtures. The mc-Si wafers were taken from the same column of Si cast ingot. After the deposition process, the layers were oxidized (thermal oxidation) in dry oxygen ambient environment at 950 degrees C to get oxide/nitride (ON) structure. Secondary ion mass spectroscopy (SIMS), Rutherford backscattering spectroscopy (RBS), Auger electron spectroscopy (AES) and energy dispersive X-ray analysis (EDX) were employed for analyzing quantitatively the chemical composition and stoichiometry in the oxide-nitride stacked films. The effect of annealing temperature on the chemical composition of ON structure has been investigated. Some species, O, N, Si were redistributed in this structure during the thermal oxidation of SiNx. Indeed, oxygen diffused to the nitride layer into Si2O2N during dry oxidation.
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