Surface modification of silicon by femtosecond laser ablation in liquid

Pulsed laser ablation is steadily gaining popularity in micromachining to keep pace with the increasing demand for precision manufacturing and functional surfaces. However, efficient laser processing under atmospheric conditions primarily suffers from particle redeposition and therefore requires additional cleaning steps to obtain high surface quality. To reduce additional cleanings steps after manufacturing, laser ablation in liquid allows for a significant reduction in particle redeposition as particles rapidly cool down and penetrate into the liquid without stitching to the surface. However, laser ablation in liquid is accompanied by the complex interaction between the hot molten material, the generated plasma and the over-critical liquid in the ablation zone. During this interaction, chemical reactions at the surface can take place and cause a persistent change of surface chemistry. Since the surface chemistry is a key aspect for micromachining, the interaction has to be studied to determine whether laser processing in liquids can be a feasible alternative to laser processing under ambient atmospheric conditions while reducing the problem of redeposition. Here, we present the results on the change of surface chemistry by laser ablation in liquid of a pristine silicon substrate. The micromachining process is either performed in an aqueous or gaseous environment and studied in dependence of laser intensity. The changes in surface chemistry are evaluated by micro-Raman spectroscopy and EDX.

Automated summary

Pulsed laser ablation in liquid reduces particle redeposition and can potentially be an alternative to laser processing under atmospheric conditions. However, the complex interaction between hot molten material, plasma, and liquid can cause persistent changes in surface chemistry.