4.7 Article

Choline chloride enhances the electrochemical stability of zinc plating/stripping

Journal

CHEMICAL COMMUNICATIONS
Volume 58, Issue 72, Pages 10088-10090

Publisher

ROYAL SOC CHEMISTRY
DOI: 10.1039/d2cc03276g

Keywords

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Funding

  1. National Natural Science Foundation of China [52061160482]
  2. Local Innovative and Research Teams Project of Guangdong Pearl River Talents Program [2017BT01N111]
  3. Shenzhen Geim Graphene Center [GJHZ20210705143000002, JSGG20191129110201725]
  4. Shenzhen Technical Project [GJHZ20210705143000002, JSGG20191129110201725]

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In this study, choline chloride (CC) was used as an additive in aqueous ZnCl2 electrolyte to improve the electrochemical stability of zinc plating/stripping. The adsorption of choline cation on the zinc anode surface inhibits zinc dendrite growth, while the -OH group disrupts the initial hydrogen bond networks in the electrolyte, alleviating water-induced side reactions. The Zn parallel to Zn symmetric cell demonstrates stable cycling for over 1700 h (1.0 mA cm(-2), 0.5 mA h cm(-)(2)).
Herein, choline chloride (CC) is adopted as an additive in an aqueous ZnCl2 electrolyte to enhance the electrochemical stability of zinc plating/stripping. The choline cation can be adsorbed on the zinc anode surface to inhibit the zinc dendrite growth. Meanwhile, the -OH group can disrupt the initial hydrogen bond networks in the electrolyte, which can alleviate the water-induced side reactions. As a result, the Zn parallel to Zn symmetric cell stably cycles for over 1700 h (1.0 mA cm(-2), 0.5 mA h cm(-)(2)).

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