4.1 Article

Numerical Simulation of Cooling Plate Using K-Epsilon Turbulence Model to Cool Down Large-Sized Graphite/LiFePO4 Battery at High C-Rates

Journal

WORLD ELECTRIC VEHICLE JOURNAL
Volume 13, Issue 8, Pages -

Publisher

MDPI
DOI: 10.3390/wevj13080138

Keywords

heat and mass transfer; LiFePO4 battery; microchannel cooling plate; MeshWorks; computational fluid dynamics

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This study presents an analogous study of the velocity and temperature profiles inside microchannel cooling plates. The experimental work used heat flux sensors and the simulation work used a computational fluid dynamics (CFD) software. The results show that the temperature of the cooling plates increases as the charging-discharging rates and ambient temperature increase.
In this paper, an analogous study of the velocity and temperature profiles inside microchannel cooling plates (with hydraulic diameter of 6 mm), placed on a large pouch-type LiFePO4 battery, is presented using both the laboratory and simulation techniques. For this, we used reverse engineering (RE), computed tomography (CT) scanning, Detroit Engineering Products (DEP) MeshWorks 8.0 for surface meshing of the cold plate, and STAR CCM+ for steady-state simulation. The numerical study was conducted for 20 A (1C) and 40 A (2C) and different operating temperatures. For experimental work, three heat flux sensors were used and were intentionally pasted at distributed locations, out of which one was situated near the negative tab (anode) and the other was near the positive tab (cathode), because the heat production is high near electrodes and the one near the mid body. Moreover, the realizable k-epsilon turbulence model in STAR CCM+ is used for simulation of the stream in a microchannel cooling plate, and the computational fluid dynamics (CFD) simulations under constant current (CC) discharge load cases are studied. Later, the validation is conducted with the lab data to ensure sufficient cooling occurs for the required range of temperature. The outcome of this research work shows that as C-rates and ambient temperature increase, the temperature contours of the cooling plates also increase.

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