4.6 Article

Kinetics of the interfacial curing reaction for an epoxy-amine mixture

Journal

PHYSICAL CHEMISTRY CHEMICAL PHYSICS
Volume 24, Issue 36, Pages 21578-21582

Publisher

ROYAL SOC CHEMISTRY
DOI: 10.1039/d2cp03394a

Keywords

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Funding

  1. JSPS KAKENHI from the Ministry of Education, Culture, Sports, Science, and Technology (MEXT), Japan [JP20H02790, JP20H02802]
  2. JST-Mirai Program [JPMJMI18A2]

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A better understanding of the chemical reaction between epoxy and amine compounds at a solid interface is crucial for designing and fabricating materials with appropriate adhesive strength. In this study, the curing reaction kinetics of epoxy phenol novolac and 4,4'-diaminodiphenyl sulfone at the outermost interface were examined using various techniques. The results showed that the reaction rate constant was higher at the interface, and the frequency factor at the interface was also greater, which could be explained by the densification and orientation of reactants at the interface.
A better understanding of the chemical reaction between epoxy and amine compounds at a solid interface is crucial for the design and fabrication of materials with appropriate adhesive strength. Here, we examined the curing reaction kinetics of epoxy phenol novolac and 4,4'-diaminodiphenyl sulfone at the outermost interface using sum-frequency generation spectroscopy, and X-ray and neutron reflectivity in conjunction with a full atomistic molecular dynamics simulation. The reaction rate constant was much larger at the quartz interface than in the bulk. While the apparent activation energy at the quartz interface obtained from an Arrhenius plot was almost identical to the bulk value, the frequency factor at the quartz interface was greater than that in the bulk. These results could be explained in terms of the densification and orientation of reactants at the interface, facilitating the encounter of the reactants present.

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