Journal
ADVANCED ELECTRONIC MATERIALS
Volume 2, Issue 6, Pages -Publisher
WILEY
DOI: 10.1002/aelm.201500459
Keywords
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Funding
- University of Minnesota, Twin Cities
- National Science Foundation through the University of Minnesota MRSEC [DMR-1420013]
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Multifunctional 3D microstructures have been extensively investigated for the development of new classes of electronic and optical devices. Here, functionalized, free-standing, hollow, 3D, dielectric (150 nm thick aluminum oxide) microcontainers with metal patterning on their surfaces are realized by an evolved self-assembly approach. To functionalize the 3D structure and use it as a device, metal patterns, arrays of split-ring resonators (SRRs) acting as metamaterials, are defined on the surface of the 3D dielectric microcontainers. The SRRs on all six facets of a given microcube show a resonant behavior in terahertz regimes. Since desired metal and semiconductor patterns can be incorporated onto surfaces of 3D dielectric microstructures, this self-assembly process can be harnessed in developing next-generation microdevices utilizing the numerous advantages of 3D configurations.
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