Journal
2022 INTERNATIONAL CONFERENCE ON ELECTRONICS PACKAGING (ICEP 2022)
Volume -, Issue -, Pages 79-80Publisher
IEEE
Keywords
data glove; wearable device; MEMS; piezoresistive sensor
Funding
- New Energy and Industrial Technology Development Organization (NEDO)
- JSPS KAKENHI [JP19H04147]
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An ultrathin Si MEMS piezoresistive strain sensor was used to fabricate a glove-shaped wearable device for measuring finger bending motion. A new mounting structure was proposed to reduce strain concentration at the connection between the sensor and the wiring.
An ultrathin Si MEMS piezoresistive strain sensor was used to fabricate a glove-shaped wearable device that can be used in VR and surgical assistance. In this paper, we proposed a mounting structure that reduces strain concentration at the connection between the sensor and the wiring. The proposed mounting structure was able to withstand strains of up to 66.9% With this structure, we succeeded in measuring the bending motion of fingers with the constructed wearable device.
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