Journal
COMPOSITES PART A-APPLIED SCIENCE AND MANUFACTURING
Volume 79, Issue -, Pages 8-13Publisher
ELSEVIER SCI LTD
DOI: 10.1016/j.compositesa.2015.09.005
Keywords
Polymer-matrix composites (PMCs); Thermal properties; Compression moulding
Funding
- Foundation of National Natural Science Foundation of China [51403175, 81400765]
- Shaanxi Natural Science Foundation of Shaanxi Province [2015JM5153, 2014JQ6203]
- Space Supporting Fund from China Aerospace Science and Industry Corporation [2014-HT-XGD]
- Aerospace Science and Technology Innovation Fund from China Aerospace Science and Technology Corporation
- Fundamental Research Funds for the Central Universities [3102015ZY066]
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Silicon carbide particle/polystyrene (SiCp/PS) electrospun mats are firstly prepared by electrospinning technology, then to be fabricated the corresponding thermally conductive SiCp/PS composites by the method of laminating-hot press. The mass fraction of SiCp and laminating mode of SiCp/PS electrospun mats affecting on the thermal conductivities, dielectric and thermal properties of the composites are investigated. The addition of 32.8 vol% SiCp improves the thermally conductive coefficient 2 of pure PS from 0.182 to 0.566 W/m K and thermal diffusivity of pure PS from 0.169 to 0.376 mm(2)/s, whereas the dielectric constant values still remain at relatively low levels. The thermal stabilities of the SiCp/PS composites are increased with the increasing addition of SiCp. For a given SiCp loading, the SiCp/PS composites from warp-weft arrangement of SiCp/PS electrospun mats possess relative higher thermally conductive coefficient lambda and dielectric constant values than those of SiCp/PS composites from warp-warp arrangement of SiCp/PS electrospun mats. (C) 2015 Elsevier Ltd. All rights reserved.
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