Journal
METALS
Volume 6, Issue 8, Pages -Publisher
MDPI AG
DOI: 10.3390/met6080182
Keywords
Ag-alloy bonding wires; current stressing; grain growth; mechanical properties
Funding
- Industrial Technology Development Program (ITDP) of the Ministry of Economic Affairs (MOEA), Taiwan [102-EC-17-A-08-11-0068]
- Wire Technology Co.
- Ministry of Science and Technology, Taiwan [MOST 103-2622-E-002-012-CC2]
Ask authors/readers for more resources
Ag-alloy bonding wires containing various Pd and Au elements and traditional 4 N Au and Pd-coated 4 N Cu bonding wires were stressed with a current density of 1.23 x 10(5) A/cm(2) in air. The amounts of annealing twins in the Ag-alloy wires were much higher than those in Au and Pd-coated Cu wires. The percentages of twinned grains in these Ag-alloy wires increased obviously with current stressing. However, the grains in Ag-3Pd and Ag-15Au-3Pd grew moderately under current stressing, in contrast to the dramatic grain growth in the other bonding wires. In addition, the breaking loads and elongations of the various Ag-alloy wires changed slightly, similar to the case of Au wire. The results implied that degradation of the mechanical properties of these annealing twinned Ag-alloy wires due to electromigration was limited. Pd-coated Cu wire was severely oxidized after current stressing for only 1 h in air, which drastically degraded both the breaking load and elongation.
Authors
I am an author on this paper
Click your name to claim this paper and add it to your profile.
Reviews
Recommended
No Data Available