4.8 Review

From cavity optomechanics to cavity-less exciton optomechanics: a review

Journal

NANOSCALE
Volume 14, Issue 45, Pages 16710-16730

Publisher

ROYAL SOC CHEMISTRY
DOI: 10.1039/d2nr03784j

Keywords

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Funding

  1. National Key Research and Development Program of China [2017YFA0303401]
  2. National Natural Science Foundation of China [12074371]
  3. Strategic Priority Research Program of Chinese Academy of Sciences [XDB28000000]

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This review discusses the mechanisms of cavity optomechanical coupling, the principles of exciton optomechanical coupling, and the recent progress in cavity-less exciton optomechanics. The integration potential of cavity-less exciton optomechanical systems is highlighted, along with their highly tunable exciton resonance.
Cavity optomechanical coupling based on radiation pressure, photothermal forces and the photoelastic effect has been investigated widely over the past few decades, including optical measurements of mechanical vibration, dynamic backaction damping and amplification, nonlinear dynamics, quantum state transfer and so on. However, the delicate cavity operation, including cavity stabilization, fine detuning, tapered fibre access etc., limits the integration of cavity optomechanical devices. Dynamic backaction damping and amplification based on cavity-less exciton optomechanical coupling in III-V semiconductor nanomechanical systems, semiconductor nanoribbons and monolayer transition metal dichalcogenides have been demonstrated in recent years. The cavity-less exciton optomechanical systems interconnect photons, phonons and excitons in a highly integrable platform, opening up the development of integrable optomechanics. Furthermore, the highly tunable exciton resonance enables the exciton optomechanical coupling strength to be tuned. In this review, the mechanisms of cavity optomechanical coupling, the principles of exciton optomechanical coupling and the recent progress of cavity-less exciton optomechanics are reviewed. Moreover, the perspectives for exciton optomechanical devices are described.

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