4.2 Article

Effect of Cu ion implantation on the structural and electrical properties of BiSbTe3 single crystals

Journal

BULLETIN OF MATERIALS SCIENCE
Volume 45, Issue 4, Pages -

Publisher

INDIAN ACAD SCIENCES
DOI: 10.1007/s12034-022-02785-3

Keywords

Topological insulators; single crystal; ion implantation; strain; electrical properties; magnetotransport properties

Funding

  1. Department of Science and Technology (DST), Government of India under Women Scientist Scheme (WOS-A) [SR/WOS-A/PM-85/2018]
  2. SERB, New Delhi [ECR/2016/1888]
  3. UGC DAE CSR Indore [CSR-IC/CRS-73/2014/435]

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Invoking defects with ion implantation is an attractive method to modify the physical parameters of materials. This study used Cu ion implantation to modify the lattice parameter and resistivity of BiSbTe3 single crystals. The results showed that Cu ion implantation reduced the lattice parameter and decreased the strain, leading to a decrease in resistivity and an enhancement of the metallic nature of the sample. The Hall coefficient indicated that holes were the dominating charge carriers.
Invoking defects with ion implantation is an attractive means to modify the physical parameters of materials. In the present work, Cu ions at fluence (1 x 10(15) ions cm(-2)) with 100 keV energy were implanted on BiSbTe3 (BST) single crystals. The X-ray diffraction (XRD) measurements on pristine and Cu ion-implanted crystals demonstrate a decrease in lattice parameter (a = b) from 4.31 to 4.26 angstrom with an increment in 'c' lattice parameter from 30.47 to 30.48 angstrom with implantation. The peaks in XRD are shifted to lower 2 theta, which are attributed to tensile strain induced in sample due to implantation. The composition of pristine BST crystal depicted from X-ray photoelectron spectroscopy is Bi:Sb:Te = 1.08:1.45:2.4. The implantation of Cu in BST single crystals is confirmed by energy dispersive X-ray technique. The resistivity measurements reveal a decrease in resistivity with implantation due to decrease in strain with Cu ion implantation. The Hall coefficient is found to be positive for both the samples signifying that the holes are the dominating charge carriers. A slight shift in Fermi level was observed with implantation. The magnetoresistance data is fitted with an equation R(B) = c+bxB(a) using Python. The parameter c varies from similar to 228 to similar to 388.5 m Omega for the pristine sample, whereas for implanted sample it varies from 5.89 to 6.66 m Omega throughout the temperature range similar to 4-300 K. This drastic reduction in c is due to the Cu ion implantation, which augments the metallic nature of the sample.

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