Journal
2022 IEEE RADIO FREQUENCY INTEGRATED CIRCUITS SYMPOSIUM (RFIC)
Volume -, Issue -, Pages 75-78Publisher
IEEE
DOI: 10.1109/RFIC54546.2022.9863127
Keywords
D-band; wireless link; receiver; transceiver; IC chip; module; PCB; high data rate; 16-QAM; low noise amplifier; LO generation; mixer; CMOS 45nm
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This paper presents an energy-efficient wideband D-band wireless link using receiver and transmitter modules based on a channel-bonding scheme. The system achieves a data rate of 56.32 Gb/s through 16 QAM modulation over 8 RF channels, with a competitive energy consumption.
This paper presents an energy-efficient wideband D-band wireless link using receiver (RX) and transmitter (TX) modules based on a channel-bonding scheme. The modules include RX and TX integrated circuits (ICs) fabricated in 45nm CMOS RFSOI technology. They are mounted on low-cost multi-layer printed circuit boards (PCBs) and connected to patch antennas. The RX and TX ICs are composed of two down-conversion and up-conversion chains, respectively, operating over contiguous sub-bands around 147.96 GHz. The required multiple millimeter-wave local oscillator signals (LOs)are generated on-chip. The presented wireless system achieves a data rate of 56.32 Gb/s by using 16 QAM modulation over 8 radiofrequency (RF) channels, with a competitive energy consumption (RX+TX) of 18 pJ/bit, including the LOs generation circuitry.
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