Journal
2022 INTERNATIONAL SYMPOSIUM ON ELECTROMAGNETIC COMPATIBILITY (EMC EUROPE 2022)
Volume -, Issue -, Pages 53-58Publisher
IEEE
DOI: 10.1109/EMCEUROPE51680.2022.9901088
Keywords
Board Level Shielding; Shielding Effectiveness; Stripline test method; Waveguide below cut-off
Categories
Funding
- Research Fund KU Leuven
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This paper presents a study of an advanced bonding technique for connecting Board Level Shielding (BLS) components to the ground layer of a Printed Circuit Board (PCB). The technique aims to achieve a higher level of Shielding Effectiveness (SE) at microwave frequencies.
This paper presents a study of an advanced bonding technique to be used in Board Level Shielding (BLS) to connect BLS components to the ground layer of a Printed Circuit Board (PCB). This bonding method uses parallel rows of vias to connect to the embedded ground (GND) layer and tries to establish a waveguide below cut-off (WGBC). In that way, a higher level of Shielding Effectiveness (SE) of BLS components may be obtained at microwave frequencies. The SE is characterized by using dedicated stripline measurement setup, which is similar to the setup used for the characterization of conductive gaskets up to 40 GHz, as specified in the standard SAE ARP 6248. This paper discusses the influence of different design parameters on the SE of BLS components at microwave frequencies.
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