Related references
Note: Only part of the references are listed.Solder Joint Reliability Assessment and Pad Size Studies of FO-WLP With Glass Substrate
P. H. Wang et al.
IEEE TRANSACTIONS ON DEVICE AND MATERIALS RELIABILITY (2021)
Effect of transient current bonding on interfacial reaction in Ag-coated graphene Sn-Ag-Cu composite solder joints
Yong-dian Han et al.
TRANSACTIONS OF NONFERROUS METALS SOCIETY OF CHINA (2021)
Influence of Substrate Surface Finish Metallurgy on Lead-Free Solder Joint Microstructure with Implications for Board-Level Reliability
Marion Branch Kelly et al.
JOURNAL OF ELECTRONIC MATERIALS (2020)
The thermal cycling reliability of copper pillar solder bump in flip chip via thermal compression bonding
Junhui Li et al.
MICROELECTRONICS RELIABILITY (2020)
Influence of Ag content on the formation and growth of intermetallic compounds in Sn-Ag-Cu solder
Bai Hailong et al.
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS (2020)
Effects of Ni modified MWCNTs on the microstructural evolution and shear strength of Sn-3.0Ag-0.5Cu composite solder joints
Haozhong Wang et al.
MATERIALS CHARACTERIZATION (2020)
The Fabrication of Ni-MWCNT Composite Solder and Its Reliability Under High Relative Humidity and Temperature
Choong-Jae Lee et al.
JOURNAL OF ELECTRONIC MATERIALS (2020)
Sintered Nanocopper Paste for High-Performance 3D Heterogeneous Package Integration
Yiteng Wang et al.
JOURNAL OF ELECTRONIC MATERIALS (2020)
Performance and reliability of Al2O3 nanoparticles doped multicomponent Sn-3.0Ag-0.5Cu-Ni-Ge solder alloy
Sanjay Tikale et al.
MICROELECTRONICS RELIABILITY (2020)
Broadband and Miniaturized Antenna-in-Package (AiP) Design for 5G Applications
Tong-Hong Lin et al.
IEEE ANTENNAS AND WIRELESS PROPAGATION LETTERS (2020)
Effects of α-Fe2O3 Additions on Assembly Reliability of Electroplated Sn-Based Solder Cap on Cu Pillar Bump During Thermal Cycling
Lijun Liu et al.
JOURNAL OF ELECTRONIC MATERIALS (2019)
Reliability enhancement of Sn-1.0Ag-0.5Cu nano-composite solders by adding multiple sizes of TiO2 nanoparticles
Yanni Wen et al.
JOURNAL OF ALLOYS AND COMPOUNDS (2017)
Effect of temperature on interface diffusion in micro solder joint under current stressing
Xue-mei Li et al.
TRANSACTIONS OF NONFERROUS METALS SOCIETY OF CHINA (2015)
Influence of TiO2 nanoparticles on IMC growth in Sn-3.0Ag-0.5Cu-xTiO2 solder joints during isothermal aging process
Y. Tang et al.
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS (2014)
Interfacial reactions between Sn-2.5Ag-2.0Ni solder and electroless Ni(P) deposited on SiCp/Al composites
Wu Mao et al.
TRANSACTIONS OF NONFERROUS METALS SOCIETY OF CHINA (2010)
Share Paper
