Journal
MICROMACHINES
Volume 7, Issue 9, Pages -Publisher
MDPI
DOI: 10.3390/mi7090167
Keywords
MEMS; three dimensional (3D); capacitive sensing system design; large dynamic range; high resolution; high-precision measurement
Categories
Funding
- National High Technology Research and Development Program of China [2011AA060502]
- Natural Science Foundation of China [41374183, 61306095, 61574067]
Ask authors/readers for more resources
This paper presents an in-plane sandwich nano-g microelectromechanical systems (MEMS) accelerometer. The proof-mass fabrication is based on silicon etching through technology using inductive coupled plasma (ICP) etching. The capacitive detection system, which employs the area-changing sensing method, combines elementary capacitive pickup electrodes with periodic-sensing-array transducers. In order to achieve a large dynamic range with an ultrahigh resolution, the capacitive detection system employs two periodic-sensing-array transducers. Each of them can provide numbers for the signal period in the entire operating range. The suspended proof-mass is encapsulated between two glass caps, which results in a three dimensional structure. The measured resonant frequency and quality factor (Q) are 13.2 Hz and 47, respectively. The calibration response of a +/- 0.7 g input acceleration is presented, and the accelerometer system presents a sensitivity of 122 V/g and a noise floor of 30 ng/Hz (at 1 Hz, and 1 atm). The bias stability for a period of 10 h is 30 g. The device has endured a shock up to +/- 2.6 g, and the full scale output appears to be approximately +/- 1.4 g presently. This work presents a new opportunity for highly sensitive MEMS fabrication to enable future high-precision measurement applications, such as for gravity measurements.
Authors
I am an author on this paper
Click your name to claim this paper and add it to your profile.
Reviews
Recommended
No Data Available