Reflective grazing incidence EUV nanoscope for wafer metrology

EUV lithography is currently being used in semiconductor high volume manufacturing, ensuring further down-scaling. However, performing non-destructive metrology at the nanoscale for different types of structures and materials is becoming a more challenging task for future technology nodes. The EUV reflective grazing incidence nanoscope (REGINE) is a new synchrotron end-station dedicated to explore non-destructive EUV metrology at the nanoscale for surface/layered structures with different material compositions. REGINE is being developed at the Swiss Light Source synchrotron and aims to enable grazing-incidence coherent diffraction imaging (CDI), scatterometry, and reflectometry in the energy range of 80 to 200 eV. In this work, we present the concept of the REGINE tool and the results of its commissioning experiments.

Automated summary

EUV lithography is a technology used in semiconductor manufacturing to achieve further size reduction. Non-destructive metrology at the nanoscale for different structures and materials is a challenging task. REGINE is a new synchrotron end-station developed to explore non-destructive EUV metrology for surface/layered structures. It aims to enable coherent diffraction imaging, scatterometry, and reflectometry in the energy range of 80 to 200 eV. This work presents the concept of REGINE and the results of commissioning experiments.