Journal
2022 EUROPEAN CONFERENCE ON OPTICAL COMMUNICATION (ECOC)
Volume -, Issue -, Pages -Publisher
IEEE
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- New Energy and Industrial Technology Development Organization (NEDO) [JPNP13004]
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In this study, a new package substrate for co-packaged optics was realized using a silicon-photonics hybrid glass-epoxy substrate with an optical redistribution layer. The transmission of 112 Gbps PAM-4 through the hybrid substrate was demonstrated with a TDECQ of less than 3.4 dB.
To realize a new package substrate for co-packaged optics, silicon-photonics hybrid glasse-poxy substrate with optical redistribution layer was demonstrated. 112 Gbps PAM-4 transmissions through the hybrid substrate were demonstrated with the TDECQ less than 3.4 dB. (c) 2022 The Author(s)
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