4.6 Article

Diffusion bonding of FGH98 superalloy and DD5 single crystal using pure Ni interlayer

Journal

MATERIALS TODAY COMMUNICATIONS
Volume 37, Issue -, Pages -

Publisher

ELSEVIER
DOI: 10.1016/j.mtcomm.2023.107003

Keywords

Diffusion bonding; Superalloy; Ni interlayer; Microstructure; Property

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In this study, the diffusion bonding of FGH98 superalloy and DD5 single crystal using a pure Ni interlayer was successfully achieved, resulting in a reinforced joint at high temperatures. With increasing temperature, diffusion was promoted significantly, favoring the formation of the reinforcing phase in the joint. However, the fracture location of the joint obtained at the highest temperature was in the interlayer zone.
In this study, the FGH98 superalloy and DD5 single crystal were diffusion bonded using pure Ni interlayer under the pressure of 4 MPa. The elemental interdiffusion of Ni interlayer and base materials induced Ni3Al phases (gamma') reinforced Ni-based solid solution (gamma) bonding seam (Ni layer zone), achieving the reliable joining of FGH98 and DD5. With the increase of diffusion bonding temperature, the elemental interdiffusion was promoted signifi-cantly, which was beneficial to the formation of gamma' phase in the joint. Due to the formation and enlargement of gamma' phase, the hardness of the Ni layer zone and the joint shear strength raised. The high diffusion bonding tem-perature (1160 degrees C) resulted in gamma' phase bulk in the Ni layer zone, and the maximum joint strength of 630 MPa was achieved. However, the fracture of the joint obtained at 1160 degrees C was located in the Ni layer zone.

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