Related references
Note: Only part of the references are listed.Formation of high-density stacking faults in ceramic films induced by Ti transition layer
Yanmeng Chen et al.
SCRIPTA MATERIALIA (2022)
Effect of heterointerface on the indentation behavior of nano-laminated c-BN/diamond composites
Cheng Huang et al.
CERAMICS INTERNATIONAL (2021)
The influence of stacking faults on mechanical behavior of advanced materials
Ruizhe Su et al.
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING (2021)
Hardening Ni3Al via complex stacking faults and twinning boundary
Zhiwei Zhang et al.
COMPUTATIONAL MATERIALS SCIENCE (2021)
Fracture toughness of thermoelectric materials
Guodong Li et al.
MATERIALS SCIENCE & ENGINEERING R-REPORTS (2021)
Distributed and localized cooling with thermoelectrics
G. Jeffrey Snyder et al.
JOULE (2021)
Weighted Mobility
G. Jeffrey Snyder et al.
ADVANCED MATERIALS (2020)
Advanced Thermoelectric Design: From Materials and Structures to Devices
Xiao-Lei Shi et al.
CHEMICAL REVIEWS (2020)
Thermoelectric transport enhancement of Te-rich bismuth antimony telluride (Bi0.5Sb1.5Te3+x) through controlled porosity
Ian T. Witting et al.
JOURNAL OF MATERIOMICS (2020)
Electronic quality factor for thermoelectrics
Xinyue Zhang et al.
SCIENCE ADVANCES (2020)
Synergetic Evolution of Sacrificial Bonds and Strain-Induced Defects Facilitating Large Deformation of the Bi2Te3 Semiconductor
Ben Huang et al.
ACS APPLIED ENERGY MATERIALS (2020)
Dislocation interaction and fracture of Cu/Ta bilayer interfaces
Anh-Son Tran et al.
PHYSICA SCRIPTA (2019)
Extraordinary thermoelectric performance in MgAgSb alloy with ultralow thermal conductivity
Yanyan Zheng et al.
NANO ENERGY (2019)
The Thermoelectric Properties of Bismuth Telluride
Ian T. Witting et al.
ADVANCED ELECTRONIC MATERIALS (2019)
Capturing anharmonic and anisotropic natures in the thermotics and mechanics of Bi2Te3 thermoelectric material through an accurate and efficient potential
Ben Huang et al.
JOURNAL OF PHYSICS D-APPLIED PHYSICS (2019)
Flexible layer-structured Bi2Te3 thermoelectric on a carbon nanotube scaffold
Qun Jin et al.
NATURE MATERIALS (2019)
Phase transformation induced plasticity in high-strength hexagonal close packed Co with stacking faults
Ruizhe Su et al.
SCRIPTA MATERIALIA (2019)
High Thermoelectric Performance of In4Se3-Based Materials and the Influencing Factors
Xin Yin et al.
ACCOUNTS OF CHEMICAL RESEARCH (2018)
Melt-Centrifuged (Bi,Sb)2Te3: Engineering Microstructure toward High Thermoelectric Efficiency
Yu Pan et al.
ADVANCED MATERIALS (2018)
Routes for high-performance thermoelectric materials
Xiaoyuan Zhou et al.
MATERIALS TODAY (2018)
Superstrengthening Bi2Te3 through Nanotwinning
Guodong Li et al.
PHYSICAL REVIEW LETTERS (2017)
Advances in thermoelectric materials research: Looking back and moving forward
Jian He et al.
SCIENCE (2017)
Enhancement of the thermoelectric performance of bulk SnTe alloys via the synergistic effect of band structure modification and chemical bond softening
Hongchao Wang et al.
JOURNAL OF MATERIALS CHEMISTRY A (2017)
Simultaneous optimization of electrical and thermal transport properties of Bi0.5Sb1.5Te3 thermoelectric alloy by twin boundary engineering
Yuan Yu et al.
NANO ENERGY (2017)
Eco-Friendly SnTe Thermoelectric Materials: Progress and Future Challenges
Raza Moshwan et al.
ADVANCED FUNCTIONAL MATERIALS (2017)
Compromise and Synergy in High-Efficiency Thermoelectric Materials
Tiejun Zhu et al.
ADVANCED MATERIALS (2017)
High thermoelectric performance in Te-free (Bi, Sb)(2)Se-3 via structural transition induced band convergence and chemical bond softening
Shanyu Wang et al.
ENERGY & ENVIRONMENTAL SCIENCE (2016)
Atomsk: A tool for manipulating and converting atomic data files
Pierre Hirel
COMPUTER PHYSICS COMMUNICATIONS (2015)
Power-Generation Characteristics After Vibration and Thermal Stresses of Thermoelectric Unicouples with CoSb3/Ti/Mo(Cu) Interfaces
Kwang Ho Bae et al.
JOURNAL OF ELECTRONIC MATERIALS (2015)
Dense dislocation arrays embedded in grain boundaries for high-performance bulk thermoelectrics
Sang Il Kim et al.
SCIENCE (2015)
Mechanically Robust BiSbTe Alloys with Superior Thermoelectric Performance: A Case Study of Stable Hierarchical Nanostructured Thermoelectric Materials
Yun Zheng et al.
ADVANCED ENERGY MATERIALS (2015)
Effects of van der Waals interactions and quasiparticle corrections on the electronic and transport properties of Bi2Te3
L. Cheng et al.
PHYSICAL REVIEW B (2014)
Thermoelectric and mechanical properties of the Bi0.5Sb1.5Te3 solid solution prepared by melt spinning
L. D. Ivanova et al.
INORGANIC MATERIALS (2013)
Thermal Cycling, Mechanical Degradation, and the Effective Figure of Merit of a Thermoelectric Module
M. T. Barako et al.
JOURNAL OF ELECTRONIC MATERIALS (2013)
Vacancy-suppressed lattice conductivity of high-ZT In4Se3-x
Hyo Seok Ji et al.
PHYSICAL REVIEW B (2013)
Nanoscale stacking faults induced low thermal conductivity in thermoelectric layered metal sulfides
Chunlei Wan et al.
APPLIED PHYSICS LETTERS (2012)
Effects of twin and stacking faults on the deformation behaviors of Al nanowires under tension loading
An Min-Rong et al.
CHINESE PHYSICS B (2012)
Effect of stacking fault and temperature on deformation behaviors of nanocrystalline Mg
H. Y. Song et al.
JOURNAL OF APPLIED PHYSICS (2012)
Computational aspects of many-body potentials
Steven J. Plimpton et al.
MRS BULLETIN (2012)
The effects of stacking fault and temperature on deformation mechanism of nanocrystalline Mg
Song Hai-Yang et al.
ACTA PHYSICA SINICA (2012)
Convergence of electronic bands for high performance bulk thermoelectrics
Yanzhong Pei et al.
NATURE (2011)
Molecular dynamics study on thermo-mechanical properties of bismuth telluride bulk
Yu Tong et al.
COMPUTATIONAL MATERIALS SCIENCE (2010)
Ab initio and molecular dynamics predictions for electron and phonon transport in bismuth telluride
Bao-Ling Huang et al.
PHYSICAL REVIEW B (2008)
Cooling, heating, generating power, and recovering waste heat with thermoelectric systems
Lon E. Bell
SCIENCE (2008)
Molecular dynamics simulation on burst and arrest of stacking faults in nanocrystalline Cu under nanoindentation
XL Ma et al.
NANOTECHNOLOGY (2003)
Thin-film thermoelectric devices with high room-temperature figures of merit
R Venkatasubramanian et al.
NATURE (2001)