Journal
2023 IEEE 73RD ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, ECTC
Volume -, Issue -, Pages 1319-1326Publisher
IEEE
DOI: 10.1109/ECTC51909.2023.00225
Keywords
advanced packaging; microelectronics encapsulation; semiconductors; epoxy molding compound; cure kinetics; thermosets; glass transition; filled polymers
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In this study, a second reaction exotherm was identified in commercial multi-resin EMC systems using differential scanning calorimetry (DSC), which is critical for designing cure schedules in manufacturing processes.
Cure kinetics of epoxy molding compounds (EMCs) is a fundamental material property that affects the molding process of semiconductor chips and final package performance. However, due to measurement challenges related to the small polymer fraction, only the main reaction is considered in the current industry practice for EMC cure kinetics evaluation. In this work, we show that a second reaction exotherm is clearly identified in commercial multi-resin EMC systems upon dynamic heating scan using differential scanning calorimetry (DSC). The second reaction completes the overall reaction from about 0.8 to 1.0 fractional conversion, which is critical for designing cure schedules to achieve ultimate properties, especially the post-mold curing (PMC) procedure during manufacturing.
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