Smoothing Enhancement of Sodium 4-Hydroxyphenylsulfonate on Cathode Copper from Simulated Leachate of Copper-Cadmium Slag by Cyclone Electrowinning

In this paper, the valuable metal copper was recovered from the leaching solution of copper-cadmium slag by cyclone electrowinning technology. During the cyclone electrowinning process, it was found that adding sodium 4-hydroxyphenylsulfonate could make the surface of cathode copper obtained by electrodeposition change benignly, make the surface of cathode copper smooth, and reduce the appearance of depressions and cracks. The effects of different sodium 4-hydroxyphenylsulfonate concentrations and different current densities on cathode copper were investigated: When the concentration range of sodium 4-hydroxyphenylsulfonate was 0 similar to 10 mg/L, the current efficiency decreased from 97.73 to 92.19%, and the deposition rate decreased from 38.95 to 36.74 mu m/h; When the current density was in the range of 200 similar to 400 m/A(2), the highest current efficiency was 92.59%, and the deposition rate increased linearly. The existence of sodium 4-hydroxyphenylsulfonate could make copper particles smaller in the electrodeposition process and inhibit the crystallization of different sizes; at high current densities, the cathode copper produces an increasingly pronounced nodular bulge, and although the deposition rate of metal ions increases linearly, the deposit morphology tends to deteriorate (rough and protrusion on the surface). Choosing proper concentration of sodium 4-hydroxyphenylsulfonate and current density could make cathode copper better in morphology and purity. Reasonable recovery of copper and cadmium slag could effectively reduce the environmental pollution caused by smelting waste and realize the secondary utilization of smelting waste. [GRAPHICS] .

Automated summary

This paper investigated the effects of different concentrations of sodium 4-hydroxyphenylsulfonate and current densities on cathode copper. Choosing proper concentration and current density can improve the morphology and purity of cathode copper.