☆ 4.5 Article

Effect of pad surface morphology on the surface shape of the lapped workpiece

PRECISION ENGINEERING-JOURNAL OF THE INTERNATIONAL SOCIETIES FOR PRECISION ENGINEERING AND NANOTECHNOLOGY (2024)

Related references

Note: Only part of the references are listed.

Article Automation & Control Systems

Theoretical and experimental analysis of surface topography and surface roughness evolution in fixed abrasive double-sided planetary lapping of YAG wafers

Lei Yang et al.

Summary: The double-sided lapping process with fixed abrasive is a promising technology for fabricating ultra-precision optical components. This research establishes a new mathematical analytical model to better understand the formation and evolution of surface topography and roughness. Experimental results demonstrate that the proposed model can effectively predict surface topography and optimize the process parameters for achieving better surface roughness.

INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY (2023)

Add to Collection

Article Engineering, Mechanical

Molecular simulation of the plastic deformation and crack formation in single grit grinding of 4H-SiC single crystal

Shang Gao et al.

Summary: This work investigated the deformation and crack formation of monocrystalline 4H-SiC involved in single grit grinding using molecular dynamics (MD) simulation. The mechanism for crack initiation and propagation in mono-crystalline 4H-SiC was revealed for the first time. Stress analysis demonstrated the driving forces and propagation directions of the cracks.

INTERNATIONAL JOURNAL OF MECHANICAL SCIENCES (2023)

Add to Collection

Article Engineering, Manufacturing

Understand anisotropy dependence of damage evolution and material removal during nanoscratch of MgF2 single crystals

Chen Li et al.

Summary: This study systematically performed nanoscratch tests on MgF2 single crystals with different crystal planes and directions to understand the anisotropy dependence of damage evolution and material removal during the machining process. The results showed that anisotropy significantly affected the damage evolution. A stress field model considering anisotropy was developed, which revealed the mechanism of damage evolution induced by scratching.

INTERNATIONAL JOURNAL OF EXTREME MANUFACTURING (2023)

Add to Collection

Article Engineering, Mechanical

Stress-Induced Deformation of Thin Copper Substrate in Double-Sided Lapping

Jiang Guo et al.

Summary: In this study, the effect of residual stress-related on the deformation of pure copper substrate during double-sided lapping was investigated using finite element method (FEM). A prediction model was proposed to simulate workpiece machining deformation in the lapping process by considering the initial residual stress and the stress caused by lapping. The results showed that the warping deformation of the workpiece in double-sided lapping is primarily caused by the redistribution of initial residual stress due to uneven material removal.

CHINESE JOURNAL OF MECHANICAL ENGINEERING (2023)

Add to Collection

Article Optics

Edge roll-off suppression method in double-sided lapping with fixed abrasives

Bo Pan et al.

Summary: This paper presents a new edge roll-off suppression method in double-sided lapping with fixed abrasives, and achieves a significant reduction in the depth and width of edge roll-off on thin copper substrates by optimizing key parameters.

APPLIED OPTICS (2022)

Add to Collection

Article Materials Science, Ceramics

Theoretical model of warping deformation during self-rotating grinding of YAG wafers

Chen Li et al.

Summary: This study develops a theoretical model for warping deformation induced by self-rotating grinding of YAG wafers, taking into consideration factors such as cutting depth, grinding force, subsurface damage, and residual stress. Experimental results show that increasing wheel rotational speed can decrease warping deformation, while increasing abrasive size, workpiece rotational speed, and feed speed can increase warping deformation.

CERAMICS INTERNATIONAL (2022)

Add to Collection

Article Engineering, Multidisciplinary

A calculation method for workpiece profile variation during double-sided lapping by considering workpiece elastic deformation

Yohei Hashimoto et al.

Summary: In this study, a calculation method for workpiece profile variation during double-sided lapping was developed using FEM deformation and contact pressure distribution. The method was found to be valuable in terms of applicable process and calculation time. It was suggested that modifying the load applied to the workpiece can help improve the bow shape of the workpiece.

PRECISION ENGINEERING-JOURNAL OF THE INTERNATIONAL SOCIETIES FOR PRECISION ENGINEERING AND NANOTECHNOLOGY (2022)

Add to Collection

Article Automation & Control Systems

Effect of kinematic parameters considering workpiece rotation on surface quality in YAG double-sided planetary lapping with the trajectory method

Lei Yang et al.

Summary: This study investigates the effect of workpiece rotational speed on surface quality during the double-sided planetary lapping process. A method to measure the workpiece rotational speed is proposed, and a mathematical model considering the rotational speed is established. The simulation results show that the uniformity of grit trajectory is significantly affected by the rotational speed ratios. Experimental tests using YAG wafers confirm the reliability of the simulation and demonstrate that better surface quality can be achieved by optimizing the rotational speed ratios.

INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY (2022)

Add to Collection

Article Engineering, Mechanical

Undeformed chip width non-uniformity modeling and surface roughness prediction in wafer self-rotational grinding process

Hongfei Tao et al.

Summary: This study proposes a new index, undeformed chip width, to analyze the stochastic characteristics in material removal process and predict the surface roughness of ground wafer. The relationship between undeformed chip width and surface roughness is discussed, and the developed models are verified through grinding experiments.

TRIBOLOGY INTERNATIONAL (2022)

Add to Collection

Article Engineering, Mechanical

Modeling the microscale contact status in chemical mechanical polishing process

Lin Wang et al.

Summary: The micro-scale contact status between the pad and the workpiece surface is crucial in determining the material removal rate during the CMP process. This paper introduces the concept of effective contact spots to evaluate the contribution of random contact status to the material removal process. Mechanical removal capacity and chemical reaction capacity parameters are defined to mathematically model the material removal process from a micro-scale chemical-mechanical synergistic perspective. Experimental observations and theoretical analysis confirm the importance of the micro-scale contact status and the dominant roles of the real contact ratio, radius, and spacing in determining the material removal rate for different materials.

INTERNATIONAL JOURNAL OF MECHANICAL SCIENCES (2022)

Add to Collection

Article Engineering, Industrial

Formation mechanism of concave and convex surface shapes in double-sided lapping

Bo Pan et al.

Summary: This study establishes a new kinematic model, considering the workpiece eccentricity and rotation in the planetary wheel for the first time, to clarify the formation mechanism of concave and convex surface shapes. The formation of the concave and convex surface shapes is experimentally validated, showing good consistency with the calculation results. In addition, a flatness error convergency method is proposed, achieving excellent flatness.

JOURNAL OF MATERIALS PROCESSING TECHNOLOGY (2022)

Add to Collection

Article Engineering, Multidisciplinary

Nonuniformity of material removal in a double-sided polishing process: Formation of convex curves

Urara Satake et al.

Summary: This study aims to understand the cause of convexity in the double-sided polishing (DSP) process and provide guiding principles for determining better DSP conditions. By studying the radial distribution of relative speed between the workpiece and polishing pads, an indicator is constructed to guide the determination of DSP conditions.

PRECISION ENGINEERING-JOURNAL OF THE INTERNATIONAL SOCIETIES FOR PRECISION ENGINEERING AND NANOTECHNOLOGY (2022)

Add to Collection

Article Materials Science, Ceramics

Micromechanics of machining and wear in hard and brittle materials

Brian R. Lawn et al.

Summary: Hard and brittle solids with covalent/ionic bonding are widely used in modern manufacturing technologies, and optimizing shaping processes can reduce manufacturing time and cost while extending component longevity. However, the same processes can also contribute to wear and fatigue degradation in service. Education development of advanced finishing protocols for this class of solids requires a comprehensive understanding of damage mechanisms at small-scale contacts from a materials perspective. The role of microstructure in material removal modes is highlighted, and pathways to future research—experimental, analytical, and computational—are indicated.

JOURNAL OF THE AMERICAN CERAMIC SOCIETY (2021)

Add to Collection

Proceedings Paper Materials Science, Multidisciplinary

Analysis and modeling of workpieces' kinematic in the process of two-sided face grinding

Leonid Vainer et al.

Summary: This study systematically analyzes the kinematic characteristics of workpiece rotation during two-sided face grinding processing, identifying six types of dependence of workpiece rotation frequency on its current coordinate in the grinding zone. Equivalent rotation characteristics for modeling the grinding process are proposed and their mathematical description is provided. The impact of workpiece rotation characteristics on the forming process and processing accuracy is considered, along with recommendations for implementing rational workpiece rotation.

MATERIALS TODAY-PROCEEDINGS (2021)

Add to Collection

Article Automation & Control Systems

The double-side lapping of SiC wafers with semifixed abrasives and resin-combined plates

Yu Yiqing et al.

INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY (2020)

Add to Collection

Article Materials Science, Ceramics

Nanoindentation and nanoscratch tests of YAG single crystals: An investigation into mechanical properties, surface formation characteristic, and theoretical model of edge-breaking size

Chen Li et al.

CERAMICS INTERNATIONAL (2020)

Add to Collection

Article Materials Science, Ceramics

Effects of polishing parameters on surface quality in sapphire double-sided CMP

Zhongyang Li et al.

CERAMICS INTERNATIONAL (2020)

Add to Collection

Article Engineering, Electrical & Electronic

Trajectory uniformity of the double-sided mechanical polishing of SiC single crystal substrate

Peng Zhang et al.

MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING (2020)

Add to Collection

Article Engineering, Multidisciplinary

Viscoelastic behavior of polishing pad: Effects on edge roll-off during silicon wafer polishing

Urara Satake et al.

PRECISION ENGINEERING-JOURNAL OF THE INTERNATIONAL SOCIETIES FOR PRECISION ENGINEERING AND NANOTECHNOLOGY (2020)

Add to Collection

Article Automation & Control Systems

Study on surface material removal uniformity in double side grinding based on grain trajectories

Qingliang Li et al.

INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY (2020)

Add to Collection

Article Engineering, Industrial

Deformation characteristics and surface generation modelling of crack-free grinding of GGG single crystals

Chen Li et al.

JOURNAL OF MATERIALS PROCESSING TECHNOLOGY (2020)

Add to Collection

Article Engineering, Industrial

The effect of process vibrations under different rotational rates on the non-uniform material removal during continuous polishing

Lele Ren et al.

JOURNAL OF MATERIALS PROCESSING TECHNOLOGY (2020)

Add to Collection

Article Crystallography

Surface Characteristics of Polished YAG Laser Crystal

Ruiqing Xie et al.

CRYSTAL RESEARCH AND TECHNOLOGY (2019)

Add to Collection

Article Materials Science, Ceramics

Correlation between polishing pad's properties and material removal during full-aperture polishing

Lele Ren et al.

INTERNATIONAL JOURNAL OF APPLIED GLASS SCIENCE (2019)

Add to Collection

Article Engineering, Manufacturing

Precision Fabrication of Thin Copper Substrate by Double-sided Lapping and Chemical Mechanical Polishing

Bo Pan et al.

JOURNAL OF MANUFACTURING PROCESSES (2019)

Add to Collection

Article Engineering, Mechanical

Physically-based modeling of pad-asperity scale chemical-mechanical synergy in chemical mechanical polishing

Lin Wang et al.

TRIBOLOGY INTERNATIONAL (2019)

Add to Collection

Article Materials Science, Ceramics

Surface shape development of the pitch lap under the loading of the conditioner in continuous polishing process

Defeng Liao et al.

JOURNAL OF THE AMERICAN CERAMIC SOCIETY (2019)

Add to Collection

Article Engineering, Manufacturing

Estimation of material removal rate distribution in double-sided polishing of thick square workpiece considering workpiece attitude

Yohei Hashimoto et al.

JOURNAL OF ADVANCED MECHANICAL DESIGN SYSTEMS AND MANUFACTURING (2019)

Add to Collection

Article Materials Science, Ceramics

Repeated nanoscratch and double nanoscratch tests of Lu2O3 transparent ceramics: Material removal and deformation mechanism, and theoretical model of penetration depth

Chen Li et al.

JOURNAL OF THE EUROPEAN CERAMIC SOCIETY (2018)

Add to Collection

Article Engineering, Multidisciplinary

Study on the double-sided grinding of sapphire substrates with the trajectory method

Lijuan Wang et al.

PRECISION ENGINEERING-JOURNAL OF THE INTERNATIONAL SOCIETIES FOR PRECISION ENGINEERING AND NANOTECHNOLOGY (2018)

Add to Collection

Article Engineering, Multidisciplinary

Modelling and experimental study of roughness in silicon wafer self-rotating grinding

Jinglong Sun et al.

PRECISION ENGINEERING-JOURNAL OF THE INTERNATIONAL SOCIETIES FOR PRECISION ENGINEERING AND NANOTECHNOLOGY (2018)

Add to Collection

Article Engineering, Manufacturing

Grinding performance of textured monolayer CBN wheels: Undeformed chip thickness nonuniformity modeling and ground surface topography prediction

Wenfeng Ding et al.

INTERNATIONAL JOURNAL OF MACHINE TOOLS & MANUFACTURE (2017)

Add to Collection

Article Engineering, Manufacturing

Chemical-mechanical wear of monocrystalline silicon by a single pad asperity

Lin Wang et al.

INTERNATIONAL JOURNAL OF MACHINE TOOLS & MANUFACTURE (2017)

Add to Collection

Article Materials Science, Multidisciplinary

Analytical modeling of grinding-induced subsurface damage in monocrystalline silicon

Hao Nan Li et al.

MATERIALS & DESIGN (2017)

Add to Collection

Article Engineering, Mechanical

Multi-scale modeling and simulation of material removal characteristics in computer-controlled bonnet polishing

Zhong-Chen Cao et al.

INTERNATIONAL JOURNAL OF MECHANICAL SCIENCES (2016)

Add to Collection

Proceedings Paper Engineering, Industrial

Optimization method for double-sided polishing process based on kinematical analysis

Urara Satake et al.

RESEARCH AND INNOVATION IN MANUFACTURING: KEY ENABLING TECHNOLOGIES FOR THE FACTORIES OF THE FUTURE - PROCEEDINGS OF THE 48TH CIRP CONFERENCE ON MANUFACTURING SYSTEMS (2016)

Add to Collection

Article Automation & Control Systems

A mixed elastohydrodynamic lubrication model with layered elastic theory for simulation of chemical mechanical polishing

Ping Zhou et al.

INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY (2013)

Add to Collection

Article Engineering, Electrical & Electronic

Finite element analysis on von Mises stress distributions of Si DSP

Yongtao Wang et al.

MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING (2013)

Add to Collection

Article Engineering, Mechanical

On the mechanism of material removal by fixed abrasive lapping of various glass substrates

Young-Jun Cho et al.

WEAR (2013)

Add to Collection

Article Chemistry, Physical

Modeling the effects of particle deformation in chemical mechanical polishing

Xiaochun Chen et al.

APPLIED SURFACE SCIENCE (2012)

Add to Collection

Article Engineering, Manufacturing

Analysis of ductile mode and brittle transition of AFM nanomachining of silicon

Seoung Hwan Lee

INTERNATIONAL JOURNAL OF MACHINE TOOLS & MANUFACTURE (2012)

Add to Collection

Article Materials Science, Ceramics

Convergent Pad Polishing of Amorphous Silica

Tayyab Suratwala et al.

INTERNATIONAL JOURNAL OF APPLIED GLASS SCIENCE (2012)

Add to Collection

Article Engineering, Manufacturing

A wafer-scale material removal rate profile model for copper chemical mechanical planarization

Hyunseop Lee et al.

INTERNATIONAL JOURNAL OF MACHINE TOOLS & MANUFACTURE (2011)

Add to Collection

Article Engineering, Industrial

Investigation of grinding modes in horizontal surface grinding of optical glass BK7

Weibin Gu et al.

JOURNAL OF MATERIALS PROCESSING TECHNOLOGY (2011)

Add to Collection

Article Materials Science, Ceramics

High-Power Solid-State Lasers: a Laser Glass Perspective

John H. Campbell et al.

INTERNATIONAL JOURNAL OF APPLIED GLASS SCIENCE (2011)

Add to Collection

Article Materials Science, Ceramics

Toward Deterministic Material Removal and Surface Figure During Fused Silica Pad Polishing

Tayyab I. Suratwala et al.

JOURNAL OF THE AMERICAN CERAMIC SOCIETY (2010)

Add to Collection

Article Automation & Control Systems

Finite-element analysis on wafer-level CMP contact stress: reinvestigated issues and the effects of selected process parameters

K. -S. Chen et al.

INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY (2009)

Add to Collection

Article Electrochemistry

Optimization of wafer-back pressure profile in chemical mechanical planarization

T. -S. Yang et al.

JOURNAL OF THE ELECTROCHEMICAL SOCIETY (2008)

Add to Collection

Article Engineering, Mechanical

A chemical mechanical polishing model based on the viscous flow of the amorphous layer

Jian-Zhong Jiang et al.

WEAR (2008)

Add to Collection

Article Automation & Control Systems

Modeling and simulation of material removal in planarization process

Thin-Lin Horng

INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY (2008)

Add to Collection

Article Chemistry, Physical

Optical measurements of silicon wafer temperature

K. Postava et al.

APPLIED SURFACE SCIENCE (2007)

Add to Collection

Article Chemistry, Physical

A calibrated atomic force microscope using an orthogonal scanner and a calibrated laser interferometer

Dong-Yeon Lee et al.

APPLIED SURFACE SCIENCE (2007)

Add to Collection

Article Engineering, Manufacturing

A plasticity-based model of material removal in chemical-mechanical polishing (CMP)

GH Fu et al.

IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING (2001)

Add to Collection

Article Electrochemistry

A model for mechanical wear and abrasive particle adhesion during the chemical mechanical polishing process

G Ahmadi et al.

JOURNAL OF THE ELECTROCHEMICAL SOCIETY (2001)

Add to Collection

© Peeref 2019-2024. All rights reserved.