4.7 Article

Nondestructive Single-Glass Vacuum Lamination Encapsulation for Perovskite Solar Cells with Long-Term Stability

Journal

SOLAR RRL
Volume -, Issue -, Pages -

Publisher

WILEY-V C H VERLAG GMBH
DOI: 10.1002/solr.202300801

Keywords

device encapsulation; finite-elements analyses; inverted perovskite solar cells; optical simulations; polymer encapsulants

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This paper investigates the mechanism of device failure during vacuum lamination of perovskite solar cells using thermal and optical simulations and experiments. It proposes a single-glass encapsulation structure that effectively prevents delamination and reduces parasitic photocurrent losses. Experimental results show that the devices encapsulated with single-glass retain exceptional stability.
Vacuum lamination encapsulation is widely adopted to prolong the duration of perovskite solar cells (PSCs) in real operation. However, additional encapsulant along with rigorous processing conditions leads to severe power conversion efficiency (PCE) loss to the corresponding devices. Herein, thermal and optical simulations and experiments are combined, to analyze the mechanisms for device failure during vacuum lamination. Single-glass encapsulation structure is proposed, which exhibits enhanced thermal conductivity, ensuring thorough and homogeneous melting of the encapsulant during the lamination process. This effectively mitigates delamination within the module and reduces parasitic photocurrent losses in the PSC device after encapsulation. Notably, the single-glass encapsulation devices retain 88% of their initial PCE after 1000 h damp heat test and successfully pass the thermal cycling standard (IEC 61 215:2016) with 95% retention of initial PCE after 250 cycles. The single-glass encapsulation leads to thorough and homogeneous melting of the encapsulant, which alleviates the compression pressure on the perovskite solar cells during the lamination process alongwith minimized parasitic optical loss caused by the incomplete melted encapsulants. This strategy yields a nondestructive encapsulated device with exceptional stability and the underlying mechanism is explored through finite-element analysis and optical simulations.image (c) 2023 WILEY-VCH GmbH

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