4.8 Article

Epitaxial Growth of 1D Te/2D MoSe2 Mixed-Dimensional Heterostructures for High-Efficient Self-Powered Photodetector

Journal

ADVANCED FUNCTIONAL MATERIALS
Volume -, Issue -, Pages -

Publisher

WILEY-V C H VERLAG GMBH
DOI: 10.1002/adfm.202311134

Keywords

CVD; heterostructure; mixed-dimension; self-powered photodetector

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This study successfully synthesizes mixed-dimensional heterostructures, in which pseudo-1D tellurium is epitaxially grown on 2D monolayer transition metal dichalcogenides. Photoluminescence results confirm the efficient transfer of photogenerated carriers from the transition metal dichalcogenides to tellurium in the heterostructure. Additionally, the heterojunction photodetector exhibits self-driven behavior and high-performance.
Mixed-dimensional heterostructures provide additional freedom to construct diverse functional electronic and optoelectronic devices, gaining significant interest. Herein, highly-aligned pseudo-1D tellurium is epitaxially grown on 2D monolayer transition metal dichalcogenides (TMDs), including MoSe2, MoS2, and WS2. A one-pot chemical vapor deposition (CVD) technique eliminates the normally required transfer steps, thereby producing mixed-dimensional heterostructures with an ultraclean interface. The controllable epitaxial growth of Te/TMD heterostructures are verified by Raman, scanning probe microscopy (SPM), and transmission electron microscopy (TEM) observation. The photoluminescence results indicate that the emission from TMDs is quenched in the heterostructure, confirming the efficient transfer of photogenerated carriers from TMDs to Te. Additionally, the mixed-dimensional p-n Te/MoSe2 heterojunction photodetector presents self-driven behavior with high responsivity (328 mA W-1), external quantum efficiency (79%), and specific detectivity (8.2 x 10(9) Jones). The modified facile synthesis strategy and proposed growth mechanism in this study shed light on synthesizing mixed-dimensional heterojunctions. This opens avenues for fabricating functional devices with reduced sizes and high densities, further enabling miniaturization and integration opportunities.

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