4.6 Article

Evaluation and in-situ monitoring of interfacial property and thermal shock resistance of epoxy adhesive with different MWCNT contents for CFRP/ GFRP hybrid composite

Journal

MATERIALS TODAY COMMUNICATIONS
Volume 37, Issue -, Pages -

Publisher

ELSEVIER
DOI: 10.1016/j.mtcomm.2023.107553

Keywords

GFRC/CFRC Hybrid Composite; Adhesion Property; Thermal Strain; Electrical Resistance Mapping

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Hybrid composites of glass fiber-reinforced composite (GFRC) and carbon fiber-reinforced composite (CFRC) provide lightweight construction and improved mechanical properties, but delamination at the interface due to thermal strain difference between materials is a concern. This study addresses the issue by using multi-walled carbon nanotubes (MWCNT) to optimize thermal strain and provide buffering effect. Experimental results show that the epoxy adhesive with 0.3 wt% MWCNT exhibits the best performance.
While glass fiber-reinforced composite (GFRC) and carbon fiber-reinforced composite (CFRC) (G/C) hybrid composites enable lightweight construction and improve mechanical properties, the difference in thermal strain between materials causes delamination at the interface. To address this issue, multi-walled carbon nanotubes (MWCNT) were applied to optimize thermal strain and provide a buffering effect. The mechanical properties were evaluated using the V-notched shear test, and the epoxy adhesive with 0.3 wt% MWCNT exhibited the best performance. The thermal strain of the materials was measured, and the epoxy adhesive showed similar thermal strain to the substrates as the MWCNT content increased. To evaluate adhesion properties and durability under different thermal shock conditions, single lap shear and cyclic short beam shear tests were performed. The load behavior of the specimens was monitored using electrical resistance (ER) mapping. It was determined that the epoxy adhesive with 0.3 wt% MWCNT exhibited superior adhesive properties and durability compared to other conditions under both thermal and cyclic loading.

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