Journal
INTERNATIONAL JOURNAL OF REFRACTORY METALS & HARD MATERIALS
Volume 118, Issue -, Pages -Publisher
ELSEVIER SCI LTD
DOI: 10.1016/j.ijrmhm.2023.106490
Keywords
Polycrystalline diamond; Hardness; Toughness; Transgranular fracture; Intergranular fracture; High pressure and high temperature
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This study successfully optimized the toughness of polycrystalline diamond (PCD) by adjusting the intergranular fracture (IF) and transgranular fracture (TF) modes. The results showed that a mixture of the IF and TF modes resulted in higher hardness and toughness in PCD compared to a single fracture mode. The toughness of the PCD was approximately three times that of single-crystal diamonds and comparable to that of pure nanotwinned diamonds. The mixed modes introduced toughening mechanisms such as high frequency large crack deflection, crack bridging, pull-out, and crack branching, which increased the toughness of the PCD.
Enhancing the fracture toughness of polycrystalline diamond (PCD) is challenging because of its inherent brit-tleness and the absence of a toughness mechanism. Elucidating the transgranular fracture (TF) and intergranular fracture (IF) modes in PCD is urgent for fabricating robust PCDs. In this study, the toughness of PCD was optimised by adjusting the IF and TF modes. The high pressure and high temperature method (HPHT) was used to fabricate PCDs with different grain sizes (nano-to micro-scale) to modulate the IF and TF modes. The results indicate that a mixture of the IF and TF modes yields an optimum toughness in PCD compared to the single fracture mode, which yielded a high hardness (114.6 GPa) and high toughness (13.0 MPa center dot m0.5). The toughness was approximately three times that of single-crystal diamonds (SCDs) and comparable to that of pure nano-twinned diamonds (NtDs). The mixed modes induce a toughening mechanism of high frequency large crack deflection, crack bridging, pull-out, and crack branching, which increases the toughness of the PCD. This work provides new insights into optimising the toughness of PCD, which is significant for fabricating robust PCDs for future applications.
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