4.8 Article

Nanoscale Vertical Resolution in Optical Printing of Inorganic Nanoparticles

Journal

ACS NANO
Volume 17, Issue 23, Pages 24268-24281

Publisher

AMER CHEMICAL SOC
DOI: 10.1021/acsnano.3c09787

Keywords

optical patterning; digital light processing; colloidal nanoparticles; surface engineering; switchingdevice

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Direct optical printing of functional inorganics has great potential for creating intricate patterns and affordable devices. However, precise control of vertical thickness in 3D structures has been overlooked. In this study, a generalized optical 3D printing process using maskless digital light processing is presented, enabling high-resolution and cost-effective fabrication of inorganic nanoparticle ink.
Direct optical printing of functional inorganics shows tremendous potential as it enables the creation of intricate two-dimensional (2D) patterns and affordable design and production of various devices. Although there have been recent advancements in printing processes using short-wavelength light or pulsed lasers, the precise control of the vertical thickness in printed 3D structures has received little attention. This control is vital to the diverse functionalities of inorganic thin films and their devices, as they rely heavily on their thicknesses. This lack of research is attributed to the technical intricacy and complexity involved in the lithographic processes. Herein, we present a generalized optical 3D printing process for inorganic nanoparticles using maskless digital light processing. We develop a range of photocurable inorganic nanoparticle inks encompassing metals, semiconductors, and oxides, combined with photolinkable ligands and photoacid generators, enabling the direct solidification of nanoparticles in the ink medium. Our process creates complex and large-area patterns with a vertical resolution of similar to 50 nm, producing 50-nm-thick 2D films and several micrometer-thick 3D architectures with no layer height difference via layer-by-layer deposition. Through fabrication and operation of multilayered switching devices with Au electrodes and Ag-organic resistive layers, the feasibility of our process for cost-effective manufacturing of multilayered devices is demonstrated.

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