Experimental study on the thermal performance of Type-C near dew point radiant cooling wall panel

The radiant cooling system is a highly promising cooling technology that offers significant development po-tential. This paper introduces an innovative aquifer-cooled radiant wall panel, comprising a box, an aluminium plate, copper tubes, and water. The inclusion of water in the box optimizes heat exchange between the copper tube and the aluminium plate, as well as promoting uniform surface temperatures throughout the radiant panel. Importantly, the installation of this radiant wall system does not compromise the height of the space, making it particularly advantageous for retrofitting buildings. Traditional radiant floor and ceiling systems often reduce the available height, potentially exceeding acceptable limits. Experimental tests have demonstrated remarkable results for the cooling capacity of the radiant cooling wall panel, with an increase of 19.5 % to 49.3 % per unit area compared to the graphite radiant cooling ceiling plate under identical test conditions. Furthermore, the maximum temperature difference observed on the panel surface during operation is less than 1.8 degrees C, highlighting the system's efficiency and reliability.

Automated summary

This paper introduces an innovative aquifer-cooled radiant wall panel system that improves cooling capacity and maintains uniform surface temperatures. Compared to traditional radiant systems, this system's installation does not compromise space height and demonstrates high efficiency and reliability in experimental tests.