Journal
IEEE MICROWAVE AND WIRELESS TECHNOLOGY LETTERS
Volume 33, Issue 2, Pages 157-160Publisher
IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
DOI: 10.1109/LMWT.2022.3220364
Keywords
3-D printing; additive manufacturing; com-plementary metal-oxide-semiconductor (CMOS); interconnects; millimeter wave; mode conversion; packaging; radio fre-quency integrated circuit (RFIC); rectangular waveguide; Vivaldi antenna; WR-6
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This study demonstrates the successful hybrid integration of a complementary metal-oxide-semiconductor (CMOS) radio frequency integrated circuit (RFIC) into a 3-D printed metal-pipe rectangular waveguide (MPRWG). On-chip Vivaldi antennas are used for TE10-to-thin-film microstrip (TFMS) mode conversion. The packaging solution has a low insertion loss of only 1 dB/transition at 126 GHz, offering new opportunities for low-cost subterahertz (THz) multichip modules.
This work demonstrates the hybrid integration of a complementary metal-oxide-semiconductor (CMOS) radio frequency integrated circuit (RFIC) into a host 3-D printed metal-pipe rectangular waveguide (MPRWG). On-chip Vivaldi antennas are used for TE10-to-thin-film microstrip (TFMS) mode conversion. Our packaging solution has a combined measured insertion loss of only 1 dB/transition at 126 GHz. This unique packaging and interconnect solution opens up new opportunities for implementing low-cost subterahertz (THz) multichip modules.
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