Journal
JOURNAL OF ZHEJIANG UNIVERSITY-SCIENCE A
Volume 24, Issue 3, Pages 206-225Publisher
ZHEJIANG UNIV PRESS
DOI: 10.1631/jzus.A2200398
Keywords
Cu alloys; Compound precipitate; Strength; Conductivity
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High-strength conductive Cu alloys are crucial in high-speed railways, 5G networks, and power transmission. The compound precipitates of alloying elements such as Cr, Zr, Fe, and Si significantly regulate the microstructure and properties of these alloys, ensuring high strength without compromising conductivity, a challenging problem in Cu alloy development. This paper comprehensively discusses the microstructure and factors influencing compound precipitates in high-strength conductive Cu alloys, such as Cu-Cr-Zr, Cu-Zr, Cu-Ni-Si, and Cu-Fe-P, and summarizes the factors affecting the precipitates from composition and process perspectives to guide property regulation. Furthermore, it introduces promising high-performance Cu alloys like Cu-Co-Si, Cu-Co-Ti, and Cu-Fe-Ti, while also exploring future research prospects for precipitation-strengthened Cu alloys.
High-strength conductive Cu alloys play an essential role in high-speed railways, 5G networks, and power transmission. The compound precipitates of alloying elements such as Cr, Zr, Fe, and Si in Cu alloys significantly regulate the microstructure and properties of these alloys. They can ensure that the alloys have high strength without damaging conductivity seriously, which is usually a difficult problem in the development of Cu alloys. This paper systematically expounds on the microstructure and concerned factors of compound precipitates in high-strength conductive Cu alloys such as Cu-Cr-Zr, Cu-Zr, Cu-Ni-Si, and Cu-Fe-P. In particular, factors affecting the precipitates are summarized from the perspectives of composition and process to guide the regulation of properties. Some new, promising, high-performance Cu alloys, including Cu-Co-Si, Cu-Co-Ti, and Cu-Fe-Ti, are described. Finally, we look at the research prospects for precipitation-strengthened Cu alloys.
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