Preparation of benzocyclobutene-functionalized organic-inorganic hybrid microspheres and their reduction of permittivity to DVSBCB resin

With the rapid development of high-frequency and high-speed communication technology, the dielectric properties of benzocyclobutene (BCB) resin, which is the key base material of copper clad laminate (CCL), need to be further improved. This work has led to a solution for the compatibility of fillers and matrix resins and the reduction of the dielectric constant of composites when DVSBCB resin is used as the matrix resin. In this work, we have developed novel BCB-functionalized organic-inorganic hybrid microspheres (BMPS), which can reduce the dielectric constant of divinylsiloxane-dibenzocyclobutene (DVSBCB) resin from 2.65 to about 2.20 (0-10 MHz) at a ratio of 2 wt%. The perfect compatibility of BMPS with DVSBCB resin, their high efficiency in reducing the dielectric constant of the resin, and their universal applicability to other BCB resins make BMPS irreplaceable compared with other fillers that have been reported for DVSBCB resin. Therefore, we believe that BMPS have great potential for facilitating the application of BCB resin in high-frequency and high-speed communication fields.

Automated summary

With the rapid development of high-frequency and high-speed communication technology, the dielectric properties of benzocyclobutene (BCB) resin need improvement. This study presents a solution for reducing the dielectric constant of DVSBCB resin using novel BCB-functionalized organic-inorganic hybrid microspheres (BMPS). The BMPS showed high compatibility with DVSBCB resin and effectively reduced its dielectric constant, making it a promising choice for high-frequency and high-speed communication applications.