Journal
AIP ADVANCES
Volume 6, Issue 8, Pages -Publisher
AMER INST PHYSICS
DOI: 10.1063/1.4961949
Keywords
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Funding
- DARPA POEM [HR0011-11-C-0100, HR0011-11-9-0009]
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We report on vertically-illuminated photodiodes fabricated in the GlobalFoundries 45nm 12SOI node and on a packaging concept for optically-interconnected chips. The photodiodes are responsive at 1180 nm -a wavelength currently used in chip-to-chip communications. They have further a wide field-of-view which enables chip-to-board positional feedback in chip-board assemblies. Monolithic integration enables on-chip processing of the positional data. (C) 2016 Author(s).
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