Journal
IEEE JOURNAL OF THE ELECTRON DEVICES SOCIETY
Volume 11, Issue -, Pages 432-437Publisher
IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
DOI: 10.1109/JEDS.2023.3297855
Keywords
Electrodes; Integrated circuit interconnections; Switches; Kinetic theory; Fabrication; Photomicrography; Field programmable gate arrays; Electrochemical metallization (ECM); lift-off; memristor; neuromorphic hardware; RRAM; ReRAM; line edge roughness; Kinetic Monte Carlo
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Lateral electrochemical metallization (ECM) cells with nanoscale geometrical distances between electrodes independent of lithography are crucial for reconfigurable interconnect systems in artificial neural networks. These cells exhibit memristive properties similar to vertical cells, with switching voltages ranging from -1.5V to 2.5V. The influence of electrode line edge roughness on SET kinetics of lateral cells is found to have minimal impact through kinetic Monte Carlo simulations.
Lateral electrochemical metallization (ECM) cells are fabricated with a combined spacer/damascene process. The process allows the realization of nanoscale geometrical distances between the two electrodes independent of lithography. Such lateral ECM cells are an essential part in a reconfigurable interconnect system that may yield a strongly increased connectivity in artificial neural networks. The lateral cells show memristive properties comparable to vertical cells with switching voltages in the range of -1.5V to 2.5V. The influence of electrode line edge roughness on SET kinetics of such lateral cells is investigated via kinetic Monte Carlo simulations, finding a minor influence on SET time variability.
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