Flexible composite phase change materials with enhanced thermal conductivity and mechanical performance for thermal management

Thermal management technologies play an important role in maintaining a relatively stable working temperature for electronics. Organic solid-liquid phase change materials (PCMs) have been widely used in thermal management systems owing to their high energy storage capacity and stable physicochemical properties. However, it is still a challenge for organic PCMs to achieve good flexibility, high thermal conductivity and complete leakage resistance simultaneously. Herein, boron nitride (BN) was pre-attached to the surface of paraffin wax microcapsules (MCPW), followed by compounding them with natural rubber (NR) to yield flexible composite PCMs with thermally conductive pathways constructed by BN. Such a localized dispersion strategy enables BN to be homogeneously dispersed in the continuous NR phase. The obtained flexible composite PCMs realize an impressive balance among salient shape stability, considerable energy storage density, excellent mechanical flexibility, and enhanced thermal conductivity, showing great potential in the field of thermal management of electronics.

Automated summary

Thermal management technologies are important for maintaining stable working temperature for electronics. Organic solid-liquid phase change materials (PCMs) are widely used due to their high energy storage capacity and stable properties. However, achieving good flexibility, high thermal conductivity and complete leakage resistance simultaneously is still a challenge for organic PCMs. This study introduces boron nitride (BN) pre-attached to the surface of paraffin wax microcapsules (MCPW) and compounded with natural rubber (NR) to form flexible composite PCMs with thermally conductive pathways constructed by BN. The obtained flexible composite PCMs exhibit impressive balance in shape stability, energy storage density, mechanical flexibility, and thermal conductivity, showing great potential for thermal management of electronics.