Journal
RSC ADVANCES
Volume 6, Issue 79, Pages 75916-75936Publisher
ROYAL SOC CHEMISTRY
DOI: 10.1039/c6ra15897h
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Funding
- Nature Science Foundation of China (NSFC) [51575016, 51475007]
- Beijing Natural Science Foundation [KZ20141000500]
- University of Tennessee Knoxville
- Oak Ridge National Lab (ORNL)
- U.S. Department of Energy [DE-AC05-00O22725]
- Laboratory Directed Research and Development program
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The continuing miniaturization of microelectronics is pushing advanced manufacturing into nanomanufacturing. Nanojoining is a bottom-up assembly technique that enables functional nanodevice fabrication with dissimilar nanoscopic building blocks and/or molecular components. Various conventional joining techniques have been modified and re-invented for joining nanomaterials. This review surveys recent progress in nanojoining methods, as compared to conventional joining processes. Examples of nanojoining are given and classified by the dimensionality of the joining materials. At each classification, nanojoining is reviewed and discussed according to materials specialties, low dimensional processing features, energy input mechanisms and potential applications. The preparation of new intermetallic materials by reactive nanoscale multilayer foils based on self-propagating high-temperature synthesis is highlighted. This review will provide insight into nanojoining fundamentals and innovative applications in power electronics packaging, plasmonic devices, nanosoldering for printable electronics, 3D printing and space manufacturing.
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