Journal
NATURE COMMUNICATIONS
Volume 7, Issue -, Pages -Publisher
NATURE PUBLISHING GROUP
DOI: 10.1038/ncomms11477
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Funding
- National Research Foundation of Korea (NRF) grant - Korea government (MSIP) [NRF-2013R1A2A2A01069070]
- Basic Science Research Program through the National Research Foundation of Korea (NRF) grant - Korea government (MEST) [NRF-2013R1A1A2011022]
- Ministry of Culture, Sports and Tourism (MCST)
- Korea Creative Content Agency (KOCCA) in the Culture Technology (CT) Research & Development Program
- 'GRI(GIST Research Institute)' Project through a grant, GIST
- Industrial Core Technology Development Program of 'Development of environmentally friendly plating process of 12-layered any layer multi-flexible PCB for wearable devices' [10052911]
- Korea Creative Content Agency (KOCCA) [R2015060029-0001] Funding Source: Korea Institute of Science & Technology Information (KISTI), National Science & Technology Information Service (NTIS)
- Korea Evaluation Institute of Industrial Technology (KEIT) [10052911] Funding Source: Korea Institute of Science & Technology Information (KISTI), National Science & Technology Information Service (NTIS)
- National Research Foundation of Korea [2013R1A1A2011022, 2013R1A2A2A01069070] Funding Source: Korea Institute of Science & Technology Information (KISTI), National Science & Technology Information Service (NTIS)
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Electronic textile (e-textile) allows for high-end wearable electronic devices that provide easy access for carrying, handling and using. However, the related technology does not seem to be mature because the woven fabric hampers not only the device fabrication process directly on the complex surface but also the transfer printing of ultrathin planar electronic devices. Here we report an indirect method that enables conformal wrapping of surface with arbitrary yet complex shapes. Artificial cilia are introduced in the periphery of electronic devices as adhesive elements. The cilia also play an important role in confining a small amount of glue and damping mechanical stress to maintain robust electronic performance under mechanical deformation. The example of electronic applications depicts the feasibility of cilia for 'stick-&-play' systems, which provide electronic functions by transfer printing on unconventional complex surfaces.
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