Depth estimation of laser glass drilling based on optical differential measurements of acoustic response

We present the first steps of a device suitable for characterization of complex 3D microstructures. This method is based on an optical approach allowing extraction and separation of high frequency ultrasonic sound waves induced to the analyzed samples. Rapid, non-destructive characterization of 3D micro-structures are limited in terms of geometrical features and optical properties of the sample. We suggest a method which is based on temporal tracking of secondary speckle patterns generated when illuminating a sample with a laser probe while applying known periodic vibration using an ultrasound transmitter. In this paper we investigated lasers drilled through glass vias. The large aspect ratios of the vias possess a challenge for traditional microscopy techniques in analyzing depth and taper profiles of the vias. The correlation of the amplitude vibrations to the vias depths is experimentally demonstrated.