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Atmospheric pressure plasmas for surface modification of flexible and printed electronic devices: A review

Journal

THIN SOLID FILMS
Volume 598, Issue -, Pages 315-334

Publisher

ELSEVIER SCIENCE SA
DOI: 10.1016/j.tsf.2015.05.035

Keywords

Atmospheric pressure plasma; Flexible electronic devices; Surface activation and treatment surface texturing; Sintering

Funding

  1. Industrial Strategic Technology Development program - Ministry of Knowledge Economy (MKE, Korea) [10041926]
  2. MOTIE (Ministry of Trade, Industry Energy [10049065]
  3. KSRC (Korea Semiconductor Research Consortium)

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Recently, non-equilibrium atmospheric pressure plasma, especially those operated at low gas temperatures, have become a topic of great interest for the processing of flexible and printed electronic devices due to several benefits such as the reduction of process and reactor costs, the employment of easy-to-handle apparatuses and the easier integration into continuous production lines. In this review, several types of typical atmospheric pressure plasma sources have been addressed, and the processes including surface treatment, texturing and sintering for application to flexible and printed electronic devices have been discussed. (C) 2015 Elsevier B.V. All rights reserved.

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