Journal
THIN SOLID FILMS
Volume 600, Issue -, Pages 90-97Publisher
ELSEVIER SCIENCE SA
DOI: 10.1016/j.tsf.2016.01.010
Keywords
ABF; Adhesion strength; Peel-off testing
Categories
Funding
- Human Resource Development Program of the Korea Institute of Energy Technology Evaluation and Planning (KETEP) - Korea government Ministry of Trade, Industry and Energy [20134030200360]
Ask authors/readers for more resources
The effect of Ar plasma pretreatment on the adhesion of the sputter-deposited Cu/Ti film, which was used as a seed layer for subsequent electrodeposition of thick Cu film, on an Ajinomoto build-up film (ABF) was evaluated as a function of the plasma power. The Ar plasma pretreatment of the ABF (above 1.2 kW) surface resulted in three-fold increase of the peel-off strength (0.70 kN/m) compared to the untreated sample (0.23 kN/m). The Ar plasma treatment produced a nanoscale worm-like surface roughness on the ABF surface which was responsible for the improved adhesion of the Cu/Ti film. Examination of the fractured surfaces revealed that when the substrate was plasma-treated above 1.2 kW, the fracture occurred in the substrate rather than by delamination of the Cu/Ti film. In fact, the fracture of the ABF substrate, which consists of the SiO2 filler embedded in a polymer resin matrix, proceeded mainly by decohesion of the SiO2 microspheres from the polymer matrix. Hence, to further improve the adhesion of the Cu/Ti film, it is advisable to consider strengthening the interface between the SiO2 filler and the resin matrix through surface modification of the SiO2 microspheres. (C) 2016 Elsevier B.V. All rights reserved.
Authors
I am an author on this paper
Click your name to claim this paper and add it to your profile.
Reviews
Recommended
No Data Available