☆ 4.8 Article

Deterministic Integration of Out-of-Plane Sensor Arrays for Flexible Electronic Applications

SMALL (2016)

Get Full Text
Add to Collection

Journal

SMALL
Volume 12, Issue 37, Pages 5141-5145

Publisher

WILEY-V C H VERLAG GMBH
DOI: 10.1002/smll.201600952

Keywords

3D integration; flexible electronics; sensors; through polymer vias

Categories

Chemistry, Multidisciplinary Chemistry, Physical Nanoscience & Nanotechnology Materials Science, Multidisciplinary Physics, Applied Physics, Condensed Matter

Funding

  1. King Abdullah University of Science and Technology (KAUST) Baseline Research Fund [BAS/1/1619-01-01]

Ask authors/readers for more resources

Protocol

Community support

Reagent

Community support

Authors

I am an author on this paper
Click your name to claim this paper and add it to your profile.

Reviews

Primary Rating

4.8
Not enough ratings

Secondary Ratings

Novelty
-
Significance
-
Scientific rigor
-
Rate this paper

Recommended

No Data Available
No Data Available
Webinars Posters Questions Hubs Funding Journals Papers Connect Collections Reviewers About Us FAQs Mobile App Privacy Policy Terms of Use
© Peeref 2019-2024. All rights reserved.