Journal
CIRP ANNALS-MANUFACTURING TECHNOLOGY
Volume 64, Issue 1, Pages 531-534Publisher
ELSEVIER SCIENCE BV
DOI: 10.1016/j.cirp.2015.04.002
Keywords
Polishing; Single crystal; Surface integrity
Funding
- MEXT, Japan [25249006]
- JST
- [25-581 2013]
- Grants-in-Aid for Scientific Research [25249006, 13J00581] Funding Source: KAKEN
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Plasma-assisted polishing (PAP), which combines plasma modification and soft abrasive polishing, was used to flatten GaN. After the irradiation of CF4 plasma, GaN was modified to GaF3, greatly decreasing its surface hardness. The modified layer was removed by polishing using a CeO2 grindstone for surface flattening. It was revealed that while many pits were generated in conventional CMP using SiO2 or CeO2 slurry, which deteriorated the surface integrity and roughness of GaN, a pit-free and atomically flat GaN surface with a Sq roughness of 0.1 nm order was obtained by the application of PAP, which is a dry polishing process. (C) 2015 CIRP.
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