Journal
SCRIPTA MATERIALIA
Volume 110, Issue -, Pages 19-23Publisher
PERGAMON-ELSEVIER SCIENCE LTD
DOI: 10.1016/j.scriptamat.2015.07.036
Keywords
Ultrasonic-assisted soldering; Die bonding; Microstructure; Intermetallic joint; Thermal conductivity
Categories
Funding
- Shenzhen Science and Technology Plan Projects [JCYJ20140417172620447]
- Nanshan Science and Technology Plan Project [KC2014JSCX0014A]
- Guangdong Province Natural Science Foundation [2014A030313693]
Ask authors/readers for more resources
Rapid formation of complete intermetallic-phases (IPs)-composed joints during die bonding for high temperature applications was achieved by pressureless and fluxless ultrasonic-assisted soldering in air within seconds. The joint consisted of sole (Cu,Ni)(6)Sn-5 plus a thin layer of Cu3Sn possessed a rather low thermal resistance of 0.252 mm(2) K W-1 and a high shear strength of 69 MPa. This rapid formation of fully IPs-composed structures was probably accelerated by ultrasonic cavitation and streaming effects through supersaturation of copper in the melted solder. Compared with transient-liquid-phase soldering, this method dramatically reduces the processing time and there was no external force acted on the dies. (C) 2015 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.
Authors
I am an author on this paper
Click your name to claim this paper and add it to your profile.
Reviews
Recommended
No Data Available
Share Paper
