Journal
SCRIPTA MATERIALIA
Volume 120, Issue -, Pages 80-84Publisher
PERGAMON-ELSEVIER SCIENCE LTD
DOI: 10.1016/j.scriptamat.2016.04.018
Keywords
Sintering; Surface modification; Copper; Oxides; Oxidation-reduction bonding
Categories
Funding
- China Scholarship Council [201306250006]
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An oxidation-reduction bonding (ORB) was applied to achieve Cu-Cu bonding with microscale Cu particle paste. During sintering at 300 degrees C, Cu2O nanoparticles were homogeneously formed on the surface of the microscale Cu particles through a thermal oxidation, and were subsequently reduced to Cu nanotextured surface in formic acid atmosphere. This in-situ surface modification significantly enhances the sinterability of the microscale Cu particles, leading to a well-sintered microstructure and a three times higher bonding strength than that of the bonding joints prepared with non-oxidation bonding (NOB). (C) 2016 Elsevier Ltd. All rights reserved.
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