Journal
PLASMA PROCESSES AND POLYMERS
Volume 14, Issue 7, Pages -Publisher
WILEY-V C H VERLAG GMBH
DOI: 10.1002/ppap.201600067
Keywords
floating substrate; interaction mode; plasma jet; polymer treatments
Funding
- National Natural Science Foundation of China [51475307]
- 973 Program [2013CB329401]
- SRFDP [20130073110087]
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Different modes are revealed and characterized in the evolution of interaction between an atmospheric pressure He/O-2 plasma jet and the parylene-C film deposited on a silicon substrate. In the initial mode, the plasma jet spreads on the film surface with the etching process layer by layer from the top to the bottom of the polymer film. Transition mode occurs with sudden change of discharge and plasma characteristics . Then coupled mode dominated the interaction process with the plasma confined in the etched hole and advanced lap by lap from inner to outer domain in the radial direction. To copper substrate, the same distinct modes were also observed. However, to the glass substrate, only layer by layer etching process was observed.
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