4.0 Article

A novel way to reduce the critical deformation for cold roll bonding

Journal

MANUFACTURING LETTERS
Volume 36, Issue -, Pages 9-12

Publisher

ELSEVIER
DOI: 10.1016/j.mfglet.2022.12.006

Keywords

Cold roll bonding; Silane; Rolling; Copper; Aluminum

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A novel approach is presented to achieve oxygen partial pressures corresponding to extremely high vacuum (XHV) for cold roll bonding. The minimum degree of deformation required to form a solid bond was reduced by up to 35% using XHV-adequate conditions. Adhesion behavior changed during bond formation in XHV-adequate conditions.
In the present study, a novel approach is presented to achieve oxygen partial pressures corresponding to extremely high vacuum (XHV) to foster cold roll bonding. Cold roll bonding of Al/Al and Cu/Cu as well as the heterogeneous combination Al/Cu were investigated with a focus on the minimum degree of defor-mation required to form a solid bond. By applying XHV-adequate conditions, the minimum degree of deformation for the formation of a solid bond could be reduced by up to 35%. Furthermore, it was evident that the adhesion behaviour changed during bond formation in XHV-adequate conditions.(c) 2023 Society of Manufacturing Engineers (SME). Published by Elsevier Ltd. All rights reserved.

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