Effect of nano-intermetallic compound on creep properties and 8-Sn grain recrystallization of Cu/Sn-Ag-Cu/Ni solder joints

Article Engineering, Electrical & Electronic

Intermediate Low-Melting-Temperature Solder Thermal Cycling Enhancement Using Bismuth and Indium Microalloying

Young-Woo Lee et al.

Summary: LTS with low melting temperature and added indium microalloy element has significant benefits in thermal cycling performance compared to conventional Sn-Ag-Cu solder.

JOURNAL OF ELECTRONIC MATERIALS (2023)

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Article Materials Science, Multidisciplinary

Microstructure and mechanical strength of Cu/Sn/Cu microbump via Ni and Zn doping into Cu substrate

Pin-Wei Huang et al.

Summary: A survey on the reaction between Cu-18Ni-18Zn substrate and Sn-3.5Ag solder during different reflow times was conducted. The traditional scallop-type Cu6Sn5 in Cu/Sn/Cu system was replaced by layer-type (Cu,Ni)6(Sn,Zn)5, and Cu3Sn disappeared while granule-type Cu5(Sn,Zn)8 was revealed. The addition of zinc-rich layer distinctly suppressed the growth of IMCs, and the volume fraction of IMCs increased significantly after it collapsed due to prolonged reflow time. The Cu-18Ni-18Zn/Sn-3.5Ag/Cu-18Ni-18Zn system showed higher shear strength compared to Cu/Sn-3.5Ag/Cu system, with an increase of approximately 32% with 150 seconds reflow process and about 111% with 300 seconds reflow process. In conclusion, the Cu-18Ni-18Zn/Sn-3.5Ag/Cu-18Ni-18Zn system is a favorable option for advanced electronic packaging in the near future.

MATERIALS CHEMISTRY AND PHYSICS (2023)

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Article Chemistry, Physical

Dislocation density and twinning-related constitutive modeling of substructural evolution in Sn-5Sb-0.5(Ag/Cu) alloys under monotonic deformation

H. Vafaeenezhad et al.

Summary: The substructure evolutions of three Sn alloys were investigated using a dislocation density constitutive equation. It was found that the addition of Cu improved the strength of Sn and the Sn-5Sb-0.5Cu alloy exhibited an enhanced work hardening rate during tensile deformation. The results of the dislocation density calculation have direct implications on the capability to model the superimposed effect of dislocation densities and subgrain boundaries on the mechanical properties of polycrystals.

JOURNAL OF ALLOYS AND COMPOUNDS (2023)

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Article Materials Science, Multidisciplinary

Orientation transformation of Cu6Sn5 grains by Ag addition in Cu/Sn-xAg/Cu micro solder joints under temperature gradient

Yuanyuan Qiao et al.

Summary: The orientation transformation of Cu6Sn5 grains in Cu/Sn-xAg/Cu micro solder joints under temperature gradient was investigated, and it was found that the transformation significantly depended on the Ag content. The results provide guidelines for improving the reliability of micro joints for 3D packaging or high temperature applications by discussing the combined effect of Ag solid solution and Ag3Sn absorbates on the orientation transformation.

JOURNAL OF MATERIALS SCIENCE (2023)

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Article Engineering, Electrical & Electronic

Microstructural, thermal and mechanical properties of Co added Sn-0.7Cu lead-free solder alloy

A. M. El-Taher et al.

Summary: This study investigates the effects of cobalt microalloying addition on the microstructural features, thermal characteristics, and mechanical behavior of eutectic Sn-0.7wt%Cu lead-free solder alloys. The addition of cobalt refines the grain of beta-Sn, promotes the formation of fine fibers (Cu,Co)(6)Sn-5 phases, and prevents the formation of eta'-Cu6Sn5 phases. Precipitation strengthening mechanisms increase the ultimate tensile strength and Young's modulus of the alloy but decrease its ductility. Additionally, the inclusion of cobalt significantly affects the thermal characteristics and may have important implications for the reliability and performance of solder in electronic service.

JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS (2023)

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Article Engineering, Electrical & Electronic

Performance and interfacial reaction mechanism of nano-IMC-mixed solder paste with variable melting point

He Gao et al.

Summary: A high-Cu-content-mixed solder paste comprising Sn-3.0Ag-0.5Cu (SAC305) + 20 wt% Sn-xCu (x = 3, 5, 8, and 10) was investigated in terms of its melting characteristics, wetting properties, fluidity, viscosity, surface tension, interfacial reaction mechanism, and shear properties. The results showed that the mixed solder paste exhibited comparable solderability and wettability to SAC305 during the initial reflow, but had restricted overflow capability during the second reflow. The composition and liquidus temperature of the mixed solder joint changed after the initial reflow, resulting in higher melt viscosity and surface tension during the second reflow. In addition, an intermetallic compound (IMC) layer formed at the copper/solder interface in the mixed solder joints, with a smaller thickness compared to SAC305. The addition of reinforced particles did not affect the shear strength of the solder joints after multiple reflows.

JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS (2023)

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Article Materials Science, Multidisciplinary

Effect of SiC nanoparticles on SAC305-TSV reliability under thermal load

Jiaojiao Wang et al.

Summary: Through silicon via (TSV) is a promising three-dimensional (3D) packaging technology for short distance electrical interconnection. This study improved the performance of SAC305 by adding SiC nanoparticles, resulting in a composite solder with better comprehensive performance. The thermal reliability of TSV filled with the composite solder was analyzed through thermal shock and aging tests.

JOURNAL OF MATERIALS SCIENCE (2022)

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Article Engineering, Electrical & Electronic

Microstructural evolution and failure analysis of Sn-Bi57-Ag0.7 solder joints during thermal cycling

Yinbo Chen et al.

Summary: This study systematically investigated the microstructural evolution and failure of Sn-Bi57-Ag0.7 solder joints during thermal cycling, providing insights into the mechanisms behind the behavior. The research highlighted the gradual changes in microstructure and thickness of the IMC layer in the solder joints, as well as the failure mechanisms related to thermal mismatch stress. Additionally, detailed analysis of grain characteristics and orientations revealed new insights compared to previous studies, shedding light on the development of reliable Sn-Bi-X solders.

JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS (2022)

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Article Materials Science, Multidisciplinary

Systematic investigation of the effect of Ni concentration in Cu-xNi/Sn couples for high temperature soldering

Xin F. Tan et al.

Summary: High temperature solders are in high demand due to the growth of high power interconnects in electric vehicles and miniaturized electronic devices. This study investigates the composition, morphology, and crystal structure of Cu-Ni Sn intermetallic compounds (IMCs) formed via transient liquid phase bonding. The findings provide insights into the physical, electrical, and mechanical properties of high temperature solders.

ACTA MATERIALIA (2022)

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Article Multidisciplinary Sciences

Microstructure and shear properties of ultrasonic-assisted Sn2.5Ag0.7Cu0.1RExNi/Cu solder joints under thermal cycling

Jianguo Cui et al.

Summary: Through ultrasonic wave-assisted Sn2.5Ag0.7Cu0.1RExNi/Cu soldering test and thermal cycling tests, it was found that ultrasonic assistance could result in high-quality and reliable solder joints. A Ni content of 0.05 wt% was identified as optimal in inhibiting excessive IMC growth and improving the shear strength of solder joints.

SCIENTIFIC REPORTS (2021)

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Article Engineering, Electrical & Electronic

Microstructure and Damage Evolution During Thermal Cycling of Sn-Ag-Cu Solders Containing Antimony

S. A. Belyakov et al.

Summary: This study investigates the impact of adding antimony to Pb-free solders on their thermal cycling performance in harsh conditions. The presence of SbSn and Ag3Sn as strengthening particles within the solder is found to significantly improve the solder's performance during accelerated thermal cycling.

JOURNAL OF ELECTRONIC MATERIALS (2021)

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Article Nanoscience & Nanotechnology