Hybrid integrated chip-scale laser systems

Photonic integrated circuits (PICs) allow for the rapid advancement of a wide range of optical devices on a compact platform, making them more useful and readily available in the commercial market. Various materials such as III-V semiconductors, silicon, silicon nitride, lithium niobate, and polymers are used to create PICs with certain unique properties. Hybrid integration can combine multiple material platforms via optical coupling and realize multi-functional PICs that overcome the limitations of a single material platform. This allows for a broad application base for hybrid integrated PICs, greatly enhancing their usability and practicality. In this paper, we will discuss the methodology and applications of hybrid integration for chip-scale laser systems, including narrow linewidth, widely tunable external cavity lasers, laser beam combining, integrated frequency combs, and integrated Pockels lasers.

Automated summary

Photonic integrated circuits (PICs) enable the rapid development of optical devices on a compact platform, enhancing their usability and availability in the commercial market. PICs can be created using various materials and hybrid integration can combine multiple material platforms, creating multi-functional PICs with unique properties. This paper discusses the methodology and applications of hybrid integration for chip-scale laser systems, including narrow linewidth lasers, widely tunable external cavity lasers, laser beam combining, integrated frequency combs, and integrated Pockels lasers.