4.7 Article

Hot deformation behavior and mechanism of cold deformed CoCrCu1.2FeNi high entropy alloy

Journal

JOURNAL OF MATERIALS RESEARCH AND TECHNOLOGY-JMR&T
Volume 27, Issue -, Pages 1173-1189

Publisher

ELSEVIER
DOI: 10.1016/j.jmrt.2023.10.037

Keywords

High entropy alloy; Hot processing map; Microstructure; Texture; Dynamic recrystallization

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The high temperature deformation behavior and mechanisms of the cold-deformed CoCrCu1.2FeNi high-entropy alloy were studied using optical microscope, scanning electron microscope, and electron backscattered diffraction. The results showed that flow stress increased with decreasing deformation temperature and increasing strain rate, and dynamic recrystallization was observed during the deformation process. Discontinuous dynamic recrystallization occurred at certain temperatures and strain rates, leading to significant recrystallization.
The high temperature deformation behavior and mechanisms of the cold-deformed CoCrCu1.2FeNi high-entropy alloy (HEA) were investigated by optical microscope (OM), scanning electron microscope (SEM) and electron backscattered diffraction (EBSD) at temperatures and strain rates of 950-1100 degrees C and 0.001-1 s-1, respectively. The results show that the flow stress increases as the deformation temperature decreases and the strain rate increases, and there is significant dynamic recrystallization (DRX) during the deformation process. 1050-1090 degrees C/0.02-1 s-1 and 975-1050 degrees C/0.002-0.2 s-1 are the optional hot temperature deformation regions. Discontinuous dynamic recrystallization (DDRX) occurs at different temperatures when the strain rate is 0.001 s-1 with a maximum recrystallization percentage of 90.28 %. The DRX degree gradually increases as the temperature rises from 950 degrees C to 1000 degrees C and from 1050 degrees C to 1100 degrees C. The maximum polar density of texture sharply increases to 11.78 at 1050 degrees C. The deformed microstructure leads to an increase in dislocation density, which could be effectively reduced by DRX.(c) 2023 The Authors. Published by Elsevier B.V. This is an open access article under the CC BY-NC-ND license (http://creativecommons.org/licenses/by-nc-nd/4.0/).

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