Journal
JOURNAL OF MATERIALS RESEARCH AND TECHNOLOGY-JMR&T
Volume 27, Issue -, Pages 1258-1264Publisher
ELSEVIER
DOI: 10.1016/j.jmrt.2023.09.313
Keywords
High-entropy alloys; Multicomponent Cantor alloy; Grain size; Mechanical behavior; Shear punch testing; Tensile testing
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The effect of grain size on the mechanical properties of a high-entropy alloy was investigated through shear punch testing and Vickers hardness measurements. The dependency of shear yield stress and tensile yield stress on average grain size was observed, and corresponding Hall-Petch relationships were established. Additionally, the correlation between tensile test properties and those predicted by shear punch testing was studied.
The effect of grain size on the mechanical properties of an equiatomic CoCrFeNiMn high-entropy alloy (HEA) was investigated by shear punch testing (SPT) as a miniature test method and Vickers hardness measurements. A Hall-Petch relationship was developed for the dependency of shear yield stress (SYS) on the average grain size (D). The correlation of the SYS and ultimate shear strength (USS) to the tensile yield stress (TYS) and ultimate tensile strength (UTS) values were also studied. A wide range of grain sizes was obtained by the thermomechanical processing of cold rolling and annealing at hot temperatures, where the primary recrystallization and grain growth phenomena were used for grain refinement and grain coarsening, respectively. Based on the obtained results and literature data, the Hall-Petch relationships of SYS = 88.9 + 301.1/root D and TYS = 167 + 520/root D were proposed, respectively. Moreover, the correlation of tensile test properties with those predicted by the shear punch test was also investigated. Accordingly, the relationships of TYS = 1.76 x SYS and UTS = 1.33 x USS were obtained, where the former is in excellent agreement with the von Mises yield criterion based on the plasticity theory, and the latter is influenced by the work-hardening behavior of the material and dynamic phenomena during plastic deformation. (c) 2023 The Author(s). Published by Elsevier B.V. This is an open access article under the CC BY license (http://creativecommons.org/licenses/by/4.0/).
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